18584603. ACOUSTIC WAVE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)

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ACOUSTIC WAVE DEVICE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Akira Noguchi of Nagaokakyo-shi (JP)

ACOUSTIC WAVE DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18584603 titled 'ACOUSTIC WAVE DEVICE

Simplified Explanation

An acoustic wave device with a multilayer body and signal wiring lines connected to an acoustic wave filter.

Key Features and Innovation

  • Multilayer body with signal wiring lines and ground electrode.
  • Acoustic wave filter electrically connected to wiring lines and ground electrode.
  • Ground electrode overlaps signal wiring lines with a missing portion in between.

Potential Applications

This technology can be used in:

  • Wireless communication devices.
  • Radar systems.
  • Sonar equipment.

Problems Solved

  • Improved signal processing efficiency.
  • Enhanced acoustic wave filtering capabilities.

Benefits

  • Higher performance in signal transmission.
  • Reduced interference in electronic devices.

Commercial Applications

  • Telecom industry for signal processing.
  • Military applications for radar and sonar systems.

Prior Art

Research on acoustic wave devices and multilayer substrates in signal processing.

Frequently Updated Research

Ongoing studies on acoustic wave filter design and optimization.

Questions about Acoustic Wave Devices

What are the main advantages of using a multilayer body in acoustic wave devices?

Using a multilayer body allows for more efficient signal processing and improved performance in electronic devices.

How does the ground electrode overlapping the signal wiring lines enhance the functionality of the device?

The ground electrode overlapping the wiring lines helps reduce interference and improve signal transmission efficiency.


Original Abstract Submitted

An acoustic wave device includes a mounting substrate including a multilayer body that includes a first layer including first and second signal wiring lines at least partially facing each other, and a second layer including a ground electrode, and an acoustic wave filter on the mounting substrate and electrically connected to the first signal wiring line, the second signal wiring line, and the ground electrode. The ground electrode overlaps the first and second signal wiring lines, and a region between the first and second signal wiring lines in plan view. A portion of the second layer overlapping the inter-wiring-line region in plan view includes a ground electrode missing portion.