18584488. SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Seungmin Baek of Suwon-si (KR)
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18584488 titled 'SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES
Simplified Explanation: The semiconductor device described in the patent application includes a seed structure with multiple layers, including barrier layers and seed layers, as well as an electrode layer.
- The seed structure consists of a first barrier layer, a first seed layer on top of the first barrier layer, a second barrier layer on the first seed layer, and a second seed layer on the second barrier layer.
- The second barrier layer makes contact with the side surface of at least one of the first barrier layer and the first seed layer.
- An electrode layer is placed on top of the seed structure.
Key Features and Innovation:
- Multilayer seed structure design for semiconductor devices.
- Improved contact between layers for enhanced performance.
- Electrode layer integration for functionality.
Potential Applications: The technology can be applied in the manufacturing of various semiconductor devices, such as transistors, diodes, and integrated circuits.
Problems Solved: The technology addresses issues related to layer contact, performance optimization, and functionality enhancement in semiconductor devices.
Benefits:
- Enhanced performance and functionality of semiconductor devices.
- Improved manufacturing processes for better quality products.
- Potential for increased efficiency and reliability in electronic systems.
Commercial Applications: The technology can be utilized in the production of advanced electronic devices for various industries, including telecommunications, consumer electronics, and automotive.
Prior Art: Readers can explore prior research on multilayer seed structures in semiconductor devices to understand the evolution of this technology.
Frequently Updated Research: Stay informed about the latest advancements in multilayer seed structures for semiconductor devices to keep up with industry trends and innovations.
Questions about Semiconductor Devices with Multilayer Seed Structure: 1. What are the key advantages of using a multilayer seed structure in semiconductor devices? 2. How does the integration of an electrode layer contribute to the overall functionality of the device?
Original Abstract Submitted
A semiconductor device may include a seed structure on a complex structure. The seed structure may include a first barrier layer, a first seed layer on the first barrier layer, a second barrier layer on the first seed layer, and a second seed layer on the second barrier layer. The second barrier layer may contact a side surface of at least one of the first barrier layer and the first seed layer. An electrode layer may be disposed on the seed structure.
