18584469. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Package
- 1.13 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SOOJEOUNG Park of Hwaseong-si (KR)
HEI SEUNG Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18584469 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution layer, a semiconductor chip with exposed chip pads, a capacitor chip, an insulating layer, and a conductive post for connection.
- The semiconductor chip has exposed first and second chip pads on its surfaces.
- A capacitor chip is placed between the semiconductor chip and the redistribution layer, with a pad connected to the first chip pad.
- An insulating layer covers the first surface and the capacitor chip.
- A conductive post connects to the second chip pad and penetrates the insulating layer to link to the redistribution layer.
Key Features and Innovation
- Semiconductor chip with exposed chip pads.
- Capacitor chip connected to the first chip pad.
- Insulating layer covering the first surface and the capacitor chip.
- Conductive post for connection to the redistribution layer.
Potential Applications
This technology can be used in various semiconductor packaging applications where capacitors are required for circuit functionality.
Problems Solved
This innovation addresses the need for efficient and compact semiconductor packaging solutions that incorporate capacitors within the package.
Benefits
- Improved circuit performance.
- Space-saving design.
- Enhanced reliability.
Commercial Applications
- Semiconductor industry for integrated circuits.
- Electronics manufacturing for compact devices.
Prior Art
Readers can explore prior art related to semiconductor packaging, redistribution layers, and capacitor integration in semiconductor devices.
Frequently Updated Research
Stay updated on the latest advancements in semiconductor packaging technologies and capacitor integration for improved circuit performance.
Questions about Semiconductor Package
What are the key components of the semiconductor package described in the patent application?
The key components include a semiconductor chip with exposed chip pads, a capacitor chip, an insulating layer, and a conductive post for connection.
How does the technology in this patent application improve semiconductor packaging?
This technology improves semiconductor packaging by integrating capacitors within the package, enhancing circuit performance and reliability.
Original Abstract Submitted
A semiconductor package includes a redistribution layer and a semiconductor chip provided on the redistribution layer having a first surface and a second surface opposite to the first surface. The semiconductor chip includes a first chip pad and a second chip pad which are exposed at the first surface. The semiconductor package further includes a capacitor chip disposed between the first surface and the redistribution layer and including a capacitor chip pad connected to the first chip pad, an insulating layer covering the first surface and the capacitor chip, and a conductive post being in contact with the second chip pad and penetrating the insulating layer so as to be connected to the redistribution layer. The conductive post may be spaced apart from the capacitor chip.
