18583743. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Hung-Jui Kuo of Hsinchu City (TW)
Yu-Hsiang Hu of Hsinchu City (TW)
Sih-Hao Liao of New Taipei City (TW)
Wei-Chih Chen of Taipei City (TW)
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18583743 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Simplified Explanation: The patent application describes a package structure for electronic components, including a die, a through via, an encapsulant, an adhesion promoter layer, an insulating layer, and a polymer layer.
- The package structure features a through via positioned next to the die, with the encapsulant surrounding both the die and the through via.
- An adhesion promoter layer and an insulating layer are sandwiched between the through via and the encapsulant.
- The sidewalls of the through via are covered by the adhesion promoter layer and the insulating layer.
- A polymer layer is located beneath the through via and encapsulant, with the insulating layer containing multiple portions.
Key Features and Innovation:
- Integration of through via, die, encapsulant, adhesion promoter layer, insulating layer, and polymer layer in a compact package structure.
- Protection of the die and through via with encapsulant and insulating layers.
- Enhanced adhesion and insulation provided by adhesion promoter layer and insulating layer.
- Efficient design for electronic component packaging.
Potential Applications: The package structure can be used in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved:
- Improved protection and insulation for electronic components.
- Enhanced adhesion between layers in the package structure.
- Efficient packaging design for electronic devices.
Benefits:
- Increased durability and reliability of electronic components.
- Enhanced performance and longevity of electronic devices.
- Simplified manufacturing process for electronic packaging.
Commercial Applications: The package structure can be utilized in the semiconductor industry for manufacturing electronic components with improved protection and insulation.
Prior Art: Prior research in the field of electronic packaging and integration of through vias in package structures can provide valuable insights into similar technologies.
Frequently Updated Research: Ongoing research on advanced packaging technologies and materials can offer new developments and improvements in electronic component packaging.
Questions about Package Structure: 1. How does the adhesion promoter layer contribute to the overall performance of the package structure? 2. What are the potential challenges in scaling up the production of electronic components using this package structure?
Original Abstract Submitted
A package structure and method of forming the same are provided. The package structure includes a die, a through via, an encapsulant, an adhesion promoter layer, an insulating layer and a polymer layer. The through via is laterally aside the die. The encapsulant laterally encapsulates the die and the a through via. The adhesion promoter layer and an insulating layer are sandwiched between the a through via and the encapsulant. Sidewalls of the a through via are covered by the adhesion promoter layer and the insulating layer. The polymer layer is located under the through via and encapsulant. The insulating layer includes a plurality of portions.
