18583411. THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wen-Sheh Huang of Hsinchu (TW)

Yu-Hsiang Chen of Hsinchu (TW)

Chii-Ping Chen of Hsinchu (TW)

THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18583411 titled 'THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES

The device described in the patent application includes a first transistor in the device layer, a first interconnect structure on the front side of the device layer, and a second interconnect structure on the backside of the device layer. The second interconnect structure features a thermal dissipation path with a dummy via for heat dissipation.

• The device includes a first transistor in the device layer.
• There is a first interconnect structure on the front side of the device layer.
• A second interconnect structure is present on the backside of the device layer.
• The second interconnect structure includes a thermal dissipation path with a dummy via for heat dissipation.
• The thermal dissipation path extends to the surface of the second interconnect structure opposite the device layer.

Potential Applications: - This technology could be used in electronic devices where heat dissipation is crucial for performance and longevity. - It could find applications in high-power electronic systems where thermal management is essential.

Problems Solved: - Addresses the issue of heat buildup in electronic devices that can affect performance and reliability. - Provides a solution for efficient heat dissipation in compact electronic devices.

Benefits: - Improved performance and reliability of electronic devices. - Enhanced thermal management capabilities. - Extended lifespan of electronic components.

Commercial Applications: Title: "Advanced Thermal Management Technology for Electronic Devices" This technology could be utilized in smartphones, laptops, tablets, and other consumer electronics to improve thermal performance and overall device reliability. It could also be integrated into industrial electronic systems where heat dissipation is critical for operation.

Prior Art: Prior research in the field of thermal management for electronic devices may include studies on heat dissipation techniques, materials with high thermal conductivity, and innovative cooling solutions.

Frequently Updated Research: Researchers are continuously exploring new materials and designs for more efficient heat dissipation in electronic devices. Stay updated on the latest advancements in thermal management technology to enhance the performance of electronic systems.

Questions about the technology: 1. How does the dummy via in the thermal dissipation path contribute to heat dissipation efficiency? 2. What are the potential challenges in implementing this thermal management technology in different types of electronic devices?

Original Abstract Submitted

A device includes a device layer comprising a first transistor; a first interconnect structure on a front-side of the device layer; and a second interconnect structure on a backside of the device layer. The second interconnect structure includes a first dielectric layer on the backside of the device layer; a contact extending through the first dielectric layer to a source/drain region of the first transistor; a conductive line electrically connected to the source/drain region of the first transistor through the contact; and a thermal dissipation path thermally connected to the device layer, the thermal dissipation path extending to a surface of the second interconnect structure opposite the device layer. The thermal dissipation path comprises a dummy via.