18583094. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)

MULTILAYER ELECTRONIC COMPONENT

Organization Name

Samsung Electro-Mechanics Co., Ltd.

Inventor(s)

So Jung An of Suwon-si (KR)

Hyung Jong Choi of Suwon-si (KR)

Jung Won Park of Suwon-si (KR)

Yoo Jeong Lee of Suwon-si (KR)

Kwang Yeun Won of Suwon-si (KR)

Woo Kyung Sung of Suwon-si (KR)

Byung Jun Jeon of Suwon-si (KR)

Chul Seung Lee of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18583094 titled 'MULTILAYER ELECTRONIC COMPONENT

The abstract of the patent application describes a multilayer electronic component with a body containing a dielectric layer and an internal electrode, as well as an external electrode with a Cu electrode layer, a Ni layer, and an intermetallic compound layer.

• The multilayer electronic component includes a body with alternating dielectric and internal electrode layers.
• The external electrode consists of a Cu electrode layer, a Ni layer, and an intermetallic compound layer.
• The first plating portion of the external electrode includes a Ni layer in contact with the electrode layer.
• The intermetallic compound layer of the external electrode includes Ni and Sn.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, aerospace systems, and medical devices.

Problems Solved: - Provides improved conductivity and reliability in electronic components. - Enhances the performance and durability of electronic devices.

Benefits: - Increased efficiency and functionality of electronic components. - Extended lifespan of electronic devices. - Reduced maintenance and repair costs.

Commercial Applications: Title: Advanced Electronic Components for Enhanced Performance This technology can be utilized by electronic manufacturers to produce high-quality and reliable electronic components for a wide range of consumer and industrial applications. The market implications include increased demand for advanced electronic components in various industries.

Questions about Multilayer Electronic Component Technology: 1. How does the intermetallic compound layer contribute to the performance of the external electrode? The intermetallic compound layer, which includes Ni and Sn, enhances the conductivity and reliability of the external electrode, leading to improved performance of the electronic component.

2. What are the advantages of using a multilayer electronic component in electronic devices? Multilayer electronic components offer increased efficiency, reliability, and durability in electronic devices, resulting in enhanced overall performance and longevity.

Original Abstract Submitted

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.