18582863. POWDER, ARTICLE, AND METHOD OF MANUFACTURING ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)
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POWDER, ARTICLE, AND METHOD OF MANUFACTURING ARTICLE
Organization Name
Inventor(s)
POWDER, ARTICLE, AND METHOD OF MANUFACTURING ARTICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18582863 titled 'POWDER, ARTICLE, AND METHOD OF MANUFACTURING ARTICLE
Simplified Explanation: The patent application describes a powder that can be shaped through irradiation with an energy beam. The powder contains a sublimable substance and a sublimation suppression material, with the latter being an inorganic compound that adheres to the surfaces of the sublimable substance particles.
- The powder is designed for shaping through energy beam irradiation.
- It consists of a sublimable substance and an inorganic sublimation suppression material.
- The sublimation suppression material adheres to the surfaces of the sublimable substance particles.
Potential Applications: 1. Additive manufacturing 2. 3D printing 3. Prototyping
Problems Solved: 1. Control of sublimation during shaping processes 2. Improved precision in shaping 3. Enhanced material properties in the final product
Benefits: 1. Increased control over shaping processes 2. Higher precision in final products 3. Enhanced material properties 4. Potential for complex geometries in shaped objects
Commercial Applications: The technology could find applications in industries such as aerospace, automotive, and medical devices for advanced manufacturing processes.
Questions about Powder for Shaping through Irradiation: 1. How does the sublimation suppression material enhance the shaping process? 2. What are the potential limitations of using this powder for shaping applications?
Original Abstract Submitted
Provided is a powder for shaping through irradiation with an energy beam, the powder including: a sublimable substance; and a sublimation suppression material, wherein the sublimation suppression material is an inorganic compound, and wherein particles of the sublimation suppression material adhere to part of surfaces of particles of the sublimable substance.
