18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chih-Hsuan Tai of Taipei City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Tsung-Hsien Chiang of Hsinchu (TW)

Yu-Chih Huang of Hsinchu (TW)

Chia-Hung Liu of Hsinchu City (TW)

Ban-Li Wu of Hsinchu City (TW)

Ying-Cheng Tseng of Tainan City (TW)

Po-Chun Lin of Hsinchu (TW)

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18582494 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

The patent application describes a package structure with a thermal dissipation structure that includes a substrate, encapsulants, a die with a sensing region, and a redistribution structure.

• The package structure includes a substrate for support.
• A first encapsulant laterally covers the substrate.
• A die is placed on the substrate and includes a sensing region.
• A second encapsulant laterally covers the die.
• A redistribution structure is disposed on the die and the second encapsulant.
• The outer sidewall of the second encapsulant is offset from the outer sidewall of the first encapsulant.
• The die is electrically coupled to the substrate through the redistribution structure.
• The redistribution structure includes a hollow region overlying the sensing region of the die.

Potential Applications: - This technology can be used in electronic devices that require efficient thermal dissipation. - It can be applied in high-power LED lighting systems. - Suitable for use in automotive electronics to manage heat dissipation effectively.

Problems Solved: - Addresses the issue of thermal management in electronic devices. - Provides a solution for dissipating heat generated by high-power components. - Ensures the longevity and reliability of electronic systems by managing thermal stress effectively.

Benefits: - Improved thermal dissipation capabilities. - Enhanced reliability and longevity of electronic components. - Better performance of electronic devices under high thermal loads.

Commercial Applications: Title: Advanced Thermal Dissipation Package Structure for Electronic Devices This technology can be utilized in: - Consumer electronics such as smartphones and laptops. - Industrial equipment with high-power components. - Automotive electronics for efficient heat management.

Prior Art: Readers can explore prior patents related to thermal dissipation structures in electronic packaging to understand the evolution of this technology.

Frequently Updated Research: Stay updated on the latest advancements in thermal management technologies for electronic devices to enhance the efficiency of this package structure.

Questions about Thermal Dissipation Package Structure: 1. How does the redistribution structure improve thermal dissipation in electronic devices? 2. What are the key differences between the first and second encapsulants in this package structure?

Original Abstract Submitted

A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.