18582329. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Hajime Tamura of Kurokawa-gun (JP)
Yasuharu Sasaki of Kurokawa-gun (JP)
Shin Yamaguchi of Kurokawa-gun (JP)
Tsuguto Sugawara of Kurokawa-gun (JP)
Katsuyuki Koizumi of Kurokawa-gun (JP)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18582329 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Simplified Explanation: The disclosed substrate support includes a first region for holding a substrate, a second region for holding an edge ring, a first electrode receiving a first electrical bias, and a second electrode receiving a second electrical bias.
- The first region of the substrate support holds the substrate securely.
- The second region surrounds the first region and holds an edge ring in place.
- The first electrode in the first region receives a first electrical bias.
- The second electrode in at least the second region receives a second electrical bias.
- The second electrode extends below the first electrode to face it within the first region.
Potential Applications: This technology could be used in semiconductor manufacturing processes, specifically in the deposition and etching of materials on substrates.
Problems Solved: This technology addresses the need for precise control and stability of electrical biases in substrate support systems during manufacturing processes.
Benefits: The benefits of this technology include improved process control, enhanced substrate stability, and increased efficiency in semiconductor manufacturing.
Commercial Applications: Potential commercial applications of this technology include semiconductor fabrication facilities, research institutions, and companies involved in advanced materials processing.
Prior Art: Readers interested in prior art related to this technology could start by researching patents or publications in the field of semiconductor manufacturing equipment and processes.
Frequently Updated Research: Stay updated on the latest advancements in substrate support technology, semiconductor manufacturing processes, and materials deposition techniques to enhance the efficiency and effectiveness of this innovation.
Questions about Substrate Support Technology: 1. What are the key advantages of using a substrate support with multiple electrodes? 2. How does the placement of the second electrode below the first electrode improve substrate stability and process control?
Original Abstract Submitted
The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.
