18582163. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Hajime Tamura of Kurokawa-gun (JP)
Yasuharu Sasaki of Kurokawa-gun (JP)
Shin Yamaguchi of Kurokawa-gun (JP)
Tsuguto Sugawara of Kurokawa-gun (JP)
Katsuyuki Koizumi of Kurokawa-gun (JP)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18582163 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Simplified Explanation: The disclosed substrate support includes a first region for holding a substrate, a second region for holding an edge ring, a first electrode receiving a first electrical bias, and a second electrode receiving a second electrical bias.
Key Features and Innovation:
- First region holds the substrate, while the second region surrounds it to hold an edge ring.
- First electrode in the first region receives a first electrical bias.
- Second electrode in at least the second region receives a second electrical bias.
- Second electrode extends below the first electrode to face it within the first region.
Potential Applications: This technology can be used in semiconductor manufacturing processes, specifically in the deposition and etching of materials on substrates.
Problems Solved: This technology addresses the need for precise control and manipulation of electrical biases in substrate support systems to optimize semiconductor manufacturing processes.
Benefits:
- Improved control over electrical biases in substrate support systems.
- Enhanced efficiency and accuracy in semiconductor manufacturing processes.
- Potential for higher quality and more reliable semiconductor products.
Commercial Applications: The technology can be applied in the semiconductor industry for the production of integrated circuits, memory devices, and other electronic components.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of semiconductor manufacturing equipment and processes.
Frequently Updated Research: Stay updated on the latest advancements in substrate support systems and semiconductor manufacturing processes to leverage the most current technologies for improved outcomes.
Questions about Substrate Support Technology: 1. What are the key advantages of using a substrate support with separate first and second electrodes? 2. How does the configuration of the first and second regions contribute to the efficiency of semiconductor manufacturing processes?
Original Abstract Submitted
The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.
