18581667. MICROELECTRONIC DEVICES WITH SOURCE REGION VERTICALLY BETWEEN TIERED DECKS, AND RELATED METHODS simplified abstract (Micron Technology, Inc.)
Contents
MICROELECTRONIC DEVICES WITH SOURCE REGION VERTICALLY BETWEEN TIERED DECKS, AND RELATED METHODS
Organization Name
Inventor(s)
Darwin A. Clampitt of Wilder ID (US)
John D. Hopkins of Meridian ID (US)
Matthew J. King of Boise ID (US)
Roger W. Lindsay of Boise ID (US)
Kevin Y. Titus of Meridian ID (US)
MICROELECTRONIC DEVICES WITH SOURCE REGION VERTICALLY BETWEEN TIERED DECKS, AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18581667 titled 'MICROELECTRONIC DEVICES WITH SOURCE REGION VERTICALLY BETWEEN TIERED DECKS, AND RELATED METHODS
The abstract of this patent application describes a microelectronic device that includes a pair of stack structures, with a lower stack structure and an upper stack structure. These structures consist of insulative and conductive structures arranged in tiers, with a source region interposed between them. Pillars extend through both stack structures towards drain regions.
- The microelectronic device features a pair of stack structures, each containing insulative and conductive structures arranged in tiers.
- A source region is located between the lower and upper stack structures.
- Pillars extend through the upper stack structure towards a first drain region and through the lower stack structure towards a second drain region.
- The device is designed for efficient electronic systems and methods.
Potential Applications: - This technology could be applied in the development of advanced microelectronic devices for various electronic systems. - It may find use in the creation of high-performance computing systems and data processing units.
Problems Solved: - Enhances the efficiency and performance of microelectronic devices. - Provides a compact and reliable design for electronic systems.
Benefits: - Improved functionality and performance of electronic systems. - Enhanced reliability and durability of microelectronic devices.
Commercial Applications: Title: Advanced Microelectronic Devices for High-Performance Computing This technology has potential commercial applications in the development of high-speed computing systems, data processing units, and advanced electronic devices for various industries.
Questions about the technology: 1. How does the design of the stack structures contribute to the efficiency of the microelectronic device? 2. What are the potential implications of this technology for the future of electronic systems and computing?
Original Abstract Submitted
A microelectronic device includes a pair of stack structures. The pair comprises a lower stack structure and an upper stack structure overlying the lower stack structure. The lower stack structure and the upper stack structure each comprise a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A source region is vertically interposed between the lower stack structure and the upper stack structure. A first array of pillars extends through the upper stack structure, from proximate the source region toward a first drain region above the upper stack structure. A second array of pillars extend through the lower stack structure, from proximate the source region toward a second drain region below the lower stack structure. Additional microelectronic devices are also disclosed, as are related methods and electronic systems.
