18581664. INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
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INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18581664 titled 'INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
The abstract describes an integrated circuit semiconductor device with lower electrodes on a substrate and a support structure supporting the lower electrodes. The support structure includes three different support structures for different portions of the lower electrodes.
- Lower electrodes are supported by a first, second, and third support structure.
- Each support structure includes a support pattern with additional holes for the lower electrodes to pass through.
- The support structures are arranged vertically to support lower, middle, and node portions of the lower electrodes.
Potential Applications: - This technology can be used in the manufacturing of integrated circuit semiconductor devices. - It can improve the stability and performance of such devices by providing adequate support for the lower electrodes.
Problems Solved: - Provides structural support for lower electrodes in integrated circuit semiconductor devices. - Ensures proper alignment and stability of the electrodes during operation.
Benefits: - Enhanced performance and reliability of integrated circuit semiconductor devices. - Improved manufacturing process efficiency and yield.
Commercial Applications: Title: Structural Support Technology for Integrated Circuit Semiconductor Devices This technology can be utilized in the semiconductor industry for the production of high-quality integrated circuit devices. It can benefit companies involved in the manufacturing and development of semiconductor components.
Prior Art: Readers can explore prior patents related to semiconductor device structures and support systems to gain a deeper understanding of the evolution of this technology.
Frequently Updated Research: Researchers in the semiconductor industry may be conducting studies on new materials and designs for support structures in integrated circuit devices. Stay updated on industry publications and conferences for the latest advancements in this field.
Questions about Structural Support Technology for Integrated Circuit Semiconductor Devices:
1. How does this technology improve the performance of integrated circuit devices?
- This technology enhances performance by providing structural support for lower electrodes, ensuring stability and alignment during operation.
2. What are the potential applications of this support structure technology in the semiconductor industry?
- This technology can be applied in the manufacturing of integrated circuit semiconductor devices to improve their reliability and performance.
Original Abstract Submitted
An integrated circuit semiconductor device includes lower electrodes on a substrate, and a support structure supporting the lower electrodes around the lower electrodes. The support structure includes a first support structure supporting lower portions of the lower electrodes, a second support structure apart from the first support structure in a vertical direction perpendicular to the substrate and supporting middle portions of the lower electrodes, and a third support structure apart from the second support structure in the vertical direction perpendicular to the substrate and supporting node portions of the lower electrodes. Each of the first support structure, the second support structure, and the third support structure includes a support pattern and additional holes formed through the support pattern. The support pattern extends in a horizontal direction parallel to the substrate and surrounds the lower electrodes. The support pattern includes holes through which the lower electrodes pass.
