18581601. COIL DEVICE simplified abstract (TDK Corporation)
Contents
COIL DEVICE
Organization Name
Inventor(s)
Toshiyuki Horikawa of Tokyo (JP)
Shinichiro Kokubo of Tokyo (JP)
COIL DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18581601 titled 'COIL DEVICE
Simplified Explanation:
This patent application describes a coil device with a coil, a bobbin, two cores facing each other, and a heat-dissipating plate attached to one of the cores. The first core has a base portion and an outer leg portion with a gap between it and the second core. The heat-dissipating plate covers part of the first core to allow for heat dissipation.
- The coil device includes a coil, a bobbin, two cores, and a heat-dissipating plate.
- The first core has a base portion and an outer leg portion with a gap between it and the second core.
- The heat-dissipating plate covers part of the first core to aid in heat dissipation.
Potential Applications: This technology could be used in various electronic devices that require efficient heat dissipation, such as transformers, inductors, and other electrical components.
Problems Solved: This technology addresses the issue of heat buildup in coil devices, which can affect their performance and longevity.
Benefits: The use of the heat-dissipating plate helps improve the overall efficiency and reliability of the coil device by preventing overheating.
Commercial Applications: Potential commercial applications include the manufacturing of electronic devices, appliances, and automotive components that rely on coil devices for operation.
Prior Art: Readers interested in prior art related to this technology could explore patents and research papers on coil devices, heat dissipation in electronic components, and core materials used in electrical engineering.
Frequently Updated Research: Researchers may find updated studies on heat dissipation techniques in coil devices, advancements in core materials, and innovations in electronic component design relevant to this technology.
Questions about Coil Devices: 1. What are the key factors to consider when designing a coil device for optimal performance? 2. How does the heat dissipation mechanism in this patent application compare to existing methods in coil device design?
Original Abstract Submitted
A coil device comprises a coil; a bobbin provided with the coil; a first core and a second core attached to the bobbin so as to face each other; and a first heat-dissipating plate attached to the first core. The first core comprises a first base portion and a first outer leg portion protruding from the first base portion and facing the second core with a gap therebetween. The gap has a gap side portion between a first side surface of the first outer leg portion and a second side surface of the second core. The first heat-dissipating plate covers at least the first base portion or the first outer leg portion so that the gap side portion is at least partly free.
