18579232. INTEGRATED OPTICAL MODULE simplified abstract (Mitsubishi Electric Corporation)
Contents
INTEGRATED OPTICAL MODULE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Satoshi Kajiya of Isahaya-Shi (JP)
Yudai Imai of Isahaya-Shi (JP)
INTEGRATED OPTICAL MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18579232 titled 'INTEGRATED OPTICAL MODULE
The abstract describes a housing of an integrated optical module with a mounting surface that has two bonding regions for different bonding materials, along with a bonding material outflow blocking part between them.
- The mounting surface of the housing has a first bonding region for bonding a loading part with light emitting elements and a second bonding region for bonding an optical multiplexer.
- A bonding material outflow blocking part is provided on the mounting surface to prevent bonding material from flowing out between the two bonding regions.
- The bonding material outflow blocking part extends in a direction intersecting with the incident direction of an optical signal, with increasing distance from the side of the loading part's bonding surface along the incident direction.
Potential Applications: - Optical communication systems - Fiber optic networks - Data transmission technologies
Problems Solved: - Preventing bonding material outflow between different bonding regions - Ensuring secure bonding of different components in the optical module
Benefits: - Improved reliability of integrated optical modules - Enhanced performance of optical communication systems
Commercial Applications: Title: Advanced Optical Module Mounting Technology for High-Speed Data Transmission This technology can be used in the telecommunications industry for high-speed data transmission applications, such as in data centers, telecommunication networks, and internet infrastructure.
Questions about the technology: 1. How does the bonding material outflow blocking part improve the performance of the integrated optical module? - The bonding material outflow blocking part prevents interference between different bonding materials, ensuring secure connections and enhancing the overall reliability of the optical module.
2. What are the key advantages of using this mounting surface design in optical communication systems? - The design allows for efficient bonding of different components, leading to improved performance and reliability in optical communication systems.
Original Abstract Submitted
A mounting surface of a housing of an integrated optical module includes a first bonding region to which a first bonding material for bonding a loading part on which a plurality of light emitting elements are loaded is to be applied, and a second bonding region to which a second bonding material for bonding an optical multiplexer is to be applied. On the mounting surface, a bonding material outflow blocking part for blocking bonding material outflow is provided between the first bonding region and the second bonding region. The bonding material outflow blocking part extends in a direction intersecting with but not orthogonal to an incident direction of an optical signal, and in advancement along the extending direction thereof, the distance from a side of a bonding surface of the loading part along the incident direction of the optical signal increases.
