18578627. METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
Contents
METHOD OF FORMING PATTERNS
Organization Name
Inventor(s)
Hyungrang Moon of Suwon-si (KR)
Youngkwon Kim of Suwon-si (KR)
METHOD OF FORMING PATTERNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18578627 titled 'METHOD OF FORMING PATTERNS
The method described in the abstract involves coating a metal-containing resist composition on a substrate, followed by coating a composition for removing edge beads along the edge of the substrate. The coated resultant is then dried and heated to form a metal-containing resist film on the substrate. Subsequently, the dried and heated resultant is exposed and developed to form a resist pattern.
- Coating a metal-containing resist composition on a substrate
- Coating a composition for removing edge beads along the edge of the substrate
- Drying and heating the coated resultant to form a metal-containing resist film on the substrate
- Exposing and developing the dried and heated resultant to form a resist pattern
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Photolithography processes
Problems Solved: - Improving pattern formation on substrates - Enhancing edge bead removal efficiency - Streamlining resist film formation
Benefits: - Enhanced precision in pattern formation - Increased efficiency in edge bead removal - Improved overall quality of resist patterns
Commercial Applications: Title: Advanced Resist Pattern Formation Method for Semiconductor Manufacturing This technology could be utilized in the semiconductor industry for more precise and efficient resist pattern formation, leading to improved overall product quality and performance. The market implications include increased productivity and cost-effectiveness in semiconductor manufacturing processes.
Prior Art: Readers interested in exploring prior art related to this technology could start by researching patents and publications in the fields of semiconductor manufacturing, photolithography, and resist pattern formation.
Frequently Updated Research: Researchers in the field of microelectronics and semiconductor manufacturing are constantly working on advancements in resist pattern formation techniques, including novel materials and processes to further improve efficiency and precision.
Questions about Resist Pattern Formation: 1. How does this method compare to traditional resist pattern formation techniques? This method offers improved precision and efficiency in resist pattern formation compared to traditional techniques, leading to higher quality patterns on substrates.
2. What are the key factors to consider when selecting a resist composition for this method? The selection of a suitable resist composition plays a crucial role in the success of this method, considering factors such as adhesion, sensitivity, and resolution requirements.
Original Abstract Submitted
Provided is a method of forming patterns that includes coating a metal-containing resist composition on a substrate; coating a composition for removing edge beads along the edge of the substrate; drying and heating the coated resultant to form a metal-containing resist film on the substrate; and exposing and developing the dried and heated resultant to form a resist pattern,
