18576236. SUBSTRATE JOINING STRUCTURE simplified abstract (Mitsubishi Electric Corporation)
Contents
SUBSTRATE JOINING STRUCTURE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Hiromitsu Itamoto of Tokyo (JP)
SUBSTRATE JOINING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18576236 titled 'SUBSTRATE JOINING STRUCTURE
Simplified Explanation: The patent application describes a method of joining conductive patterns of flexible and print substrates using solder, with a through hole connecting ground patterns.
- Solder joins conductive patterns of flexible and print substrates.
- Through hole connects ground patterns of the substrates.
- Solder joint portion is shifted from the through hole end.
Key Features and Innovation:
- Joining of conductive patterns using solder.
- Connection of ground patterns through a through hole.
- Shifting of solder joint portion from the through hole end.
Potential Applications: This technology can be used in the manufacturing of electronic devices, flexible circuits, and printed circuit boards.
Problems Solved: This technology solves the challenge of securely joining conductive patterns of different substrates while maintaining electrical connections.
Benefits:
- Improved reliability of connections.
- Enhanced flexibility in circuit design.
- Efficient manufacturing process.
Commercial Applications: The technology can be applied in the production of consumer electronics, medical devices, automotive systems, and aerospace equipment.
Prior Art: Prior research in the field of flexible electronics and printed circuit board assembly can provide insights into similar methods and techniques.
Frequently Updated Research: Stay updated on advancements in flexible electronics manufacturing, soldering techniques, and circuit board assembly processes for potential improvements in this technology.
Questions about the Technology: 1. How does this technology improve the reliability of electronic connections? 2. What are the potential challenges in implementing this method in mass production?
Original Abstract Submitted
Solder () joins together a second conductive pattern () of a flexible substrate () and a third conductive pattern () of a print substrate () and joins together a second GND pattern () of the flexible substrate () and a third GND pattern () of the print substrate (). A through hole () passes through the flexible substrate () and connects the first and second GND patterns () together. In an extension direction in which the second conductive pattern () extends, an end portion of a solder joint portion between the second conductive pattern () and the third conductive pattern () is in a position corresponding to the through hole () and is shifted from an end portion of the through hole ().
