18576096. SHIELDED ELECTRICALLY CONDUCTIVE PATH simplified abstract (Sumitomo Wiring Systems, Ltd.)

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SHIELDED ELECTRICALLY CONDUCTIVE PATH

Organization Name

Sumitomo Wiring Systems, Ltd.

Inventor(s)

Kazuaki Hamada of Osaka (JP)

SHIELDED ELECTRICALLY CONDUCTIVE PATH - A simplified explanation of the abstract

This abstract first appeared for US patent application 18576096 titled 'SHIELDED ELECTRICALLY CONDUCTIVE PATH

Simplified Explanation: The patent application describes a sleeve that surrounds an exposed part extending forward of the sheath, out of the shield layer, and is crimped to an outer peripheral surface of the insulation coating. The sleeve is crimped to a crimping portion of an outer conductor of a shield terminal while surrounding the sleeve and a region behind it, out of the insulation coating. Inner and outer peripheral side locking portions are formed in a region covering the insulation coating, out of the crimping portion.

  • The sleeve surrounds an exposed part extending forward of the sheath.
  • The sleeve is crimped to an outer peripheral surface of the insulation coating.
  • The crimping portion of an outer conductor of a shield terminal is crimped to the sleeve.
  • Inner and outer peripheral side locking portions are formed in a region covering the insulation coating.
  • The inner peripheral side locking portion is located more radially inward than a region surrounding the sleeve.

Potential Applications: This technology could be used in the manufacturing of electrical cables, connectors, and other electronic devices where secure connections are required.

Problems Solved: This technology addresses the challenge of securely connecting shield terminals to insulation coatings in electronic devices.

Benefits: The benefits of this technology include improved connection reliability, enhanced durability, and increased efficiency in electronic device manufacturing processes.

Commercial Applications: Title: Secure Shield Terminal Connection Technology in Electronic Devices This technology can be applied in industries such as telecommunications, automotive, aerospace, and consumer electronics for the production of high-quality and reliable electronic devices.

Prior Art: Researchers can explore prior patents related to shield terminal connections, crimping technologies, and insulation coating methods in the field of electronic device manufacturing.

Frequently Updated Research: Stay informed about advancements in crimping techniques, insulation materials, and connector design in the electronics industry to enhance the application of this technology.

Questions about Shield Terminal Connection Technology: 1. What are the key advantages of using a sleeve for shield terminal connections? 2. How does this technology improve the overall performance of electronic devices?


Original Abstract Submitted

A sleeve surrounds an exposed part extending forward of the sheath, out of the shield layer, and is crimped to an outer peripheral surface of the insulation coating. A crimping portion of an outer conductor of a shield terminal is crimped to the sleeve while surrounding the sleeve and a region behind the sleeve, out of the insulation coating. An inner peripheral side locking portion and an outer peripheral side locking portion are formed in a region covering the insulation coating, out of the crimping portion. The inner peripheral side locking portion is located more radially inward than a region surrounding the sleeve, out of the crimping portion. The outer peripheral side locking portion is locked to the inner peripheral side locking portion while being accommodated in a recess in an outer peripheral surface of the inner peripheral side locking portion.