18570678. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18570678 titled 'SEMICONDUCTOR DEVICE
The patent application describes a board with a cavity region and a semiconductor chip mounted on the back-side conductor, covered by a mold material to prevent failures and reduce warpage.
- Board with a cavity region and opening on the front side
- Back-side conductor forming the bottom portion of the cavity region
- Semiconductor chip mounted on the back-side conductor
- Mold material covering the semiconductor chip and board
- Mold material interconnected through at least one hole in the board to prevent failures and reduce warpage
Potential Applications: - Electronics manufacturing - Semiconductor packaging industry - Consumer electronics
Problems Solved: - Preventing failures such as deformation or cracks in the board - Reducing warpage to prevent peeling of the mold material
Benefits: - Improved reliability of electronic devices - Enhanced durability of semiconductor packaging - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be used in the production of various electronic devices, such as smartphones, tablets, and computers, to improve their performance and longevity. The market implications include increased demand for high-quality semiconductor packaging solutions in the electronics industry.
Prior Art: Researchers can explore prior patents related to semiconductor packaging technologies, board design, and mold materials to understand the evolution of similar innovations in the field.
Frequently Updated Research: Researchers in the semiconductor industry may be conducting studies on novel materials for mold compounds, advanced board designs, and innovative methods for mounting semiconductor chips to enhance the reliability and performance of electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does this technology compare to traditional semiconductor packaging methods? This technology offers improved reliability and durability compared to traditional methods by preventing failures and reducing warpage through innovative design and materials.
2. What are the potential cost savings associated with implementing this advanced semiconductor packaging technology? By preventing failures and reducing the need for frequent repairs or replacements, this technology can lead to cost savings in the manufacturing and maintenance of electronic devices.
Original Abstract Submitted
Provided here are: a board; a cavity region therein having an opening created on a front side of a central portion of the board; a back-side conductor that is formed for the board to provide a bottom portion of the cavity region; a semiconductor chip mounted on the back-side conductor; and a mold material that covers the semiconductor chip and the board; wherein the mold material has a portion on the front side of the board and a portion on the back side thereof that are interconnected through at least one hole provided in the board, thereby to prevent failures such as a deformation, a crack, etc. of the board; and to reduce the warpage of the board to prevent the mold material from being peeled off therefrom.
