18566183. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Yohei Nakagomi of Nirasaki City, Yamanashi (JP)
Ryo Kuwajima of Nirasaki City, Yamanashi (JP)
Yohei Midorikawa of Nirasaki City, Yamanashi (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18566183 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with an inner chamber for accommodating the substrate, an outer chamber outside the inner chamber, and a processing gas supplier that provides processing gas to the inner chamber. The inner chamber can be detached from the outer chamber, which does not come into contact with the processing gas.
- Inner chamber for substrate accommodation
- Outer chamber separate from inner chamber
- Processing gas supplier for supplying gas to inner chamber
- Detachable inner chamber
- Outer chamber does not contact processing gas
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production
Problems Solved: - Contamination of processing gas - Ease of maintenance and cleaning - Flexibility in substrate processing
Benefits: - Improved substrate processing efficiency - Reduced risk of contamination - Enhanced maintenance capabilities
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be utilized in semiconductor fabrication facilities, thin film deposition companies, and solar panel manufacturing plants. The innovation offers a more efficient and reliable substrate processing solution, leading to improved product quality and production output.
Questions about Substrate Processing Apparatus: 1. How does the detachable inner chamber benefit the overall substrate processing?
- The detachable inner chamber allows for easier maintenance and cleaning, reducing downtime and improving overall efficiency.
2. What are the potential drawbacks of the outer chamber not coming into contact with the processing gas?
- The lack of contact between the outer chamber and processing gas helps prevent contamination, ensuring a cleaner processing environment.
Original Abstract Submitted
A substrate processing apparatus for processing a substrate, includes: an inner chamber in which the substrate is accommodated; an outer chamber provided outside the inner chamber, and a processing gas supplier configured to supply a processing gas to an interior of the inner chamber, wherein the inner chamber is configured to be detachable from the outer chamber, and the outer chamber is provided such that the outer chamber does not come into contact with the processing gas supplied to the interior of the inner chamber.
