18566121. THERMALLY CONDUCTIVE SILICONE COMPOSITION simplified abstract (Dow Silicones Corporation)
Contents
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Organization Name
Inventor(s)
Dorab Bhagwagar of Saginaw MI (US)
THERMALLY CONDUCTIVE SILICONE COMPOSITION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18566121 titled 'THERMALLY CONDUCTIVE SILICONE COMPOSITION
The composition described in the abstract is a curable silicone composition that includes a vinyldimethylsiloxy-terminated polydimethylpolysiloxane, a silicon-hydride functional crosslinker, and a hydrosilylation catalyst. It also contains a filler treating agent and a thermally conductive filler mixture.
Key Features and Innovation:
- The silicone composition includes specific components such as a vinyldimethylsiloxy-terminated polydimethylpolysiloxane, a silicon-hydride functional crosslinker, and a hydrosilylation catalyst.
- The filler treating agent comprises an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane.
- The thermally conductive filler mixture consists of aluminum nitride fillers, aluminum oxide particles, and zinc oxide particles in specific ratios.
Potential Applications:
- This composition can be used in various industries such as electronics, automotive, and aerospace for applications requiring thermal conductivity and flexibility.
Problems Solved:
- This composition addresses the need for a curable silicone material with enhanced thermal conductivity and mechanical properties.
Benefits:
- Improved thermal conductivity and mechanical strength.
- Enhanced flexibility and curing properties.
- Versatile applications in different industries.
Commercial Applications:
- This technology can be utilized in the production of electronic components, automotive parts, and heat dissipation systems in various commercial applications.
Questions about the technology: 1. How does the specific composition of the thermally conductive filler mixture contribute to the overall performance of the silicone composition? 2. What are the potential challenges in scaling up the production of this curable silicone composition for commercial use?
Original Abstract Submitted
A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslinker, and (a3) a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and (C) a thermally conductive filler mixture including (c1) 40-55 wt % of aluminum nitride fillers, containing a blend of: (c1-a) 15-41 wt % of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of 20-80 micrometers; (c2) spherical aluminum oxide particles having a D50 particle size of 1-5 micrometers; and (c3) 10-20 wt % of irregular zinc oxide particles having a D50 particle size of 0.1-0.5 micrometer; where the total amount of the thermally conductive filler mixture is 94-97 wt %; and where wt % values are relative to the weight of the thermally conductive composition unless otherwise stated.
