18562502. SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Yoshihisa Matsubara of Tokyo (JP)
Yoshihiro Tsutsumi of Tokyo (JP)
Yohei Yamashita of Kumamoto (JP)
SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18562502 titled 'SUBSTRATE PROCESSING METHOD
The substrate processing method described in the patent application involves several key processes.
- The first process involves preparing a laminated substrate with specific layers in a particular order.
- The second process includes irradiating laser light onto the first substrate from the opposite side of the second substrate.
- The third process entails irradiating the laser light transmitted through the first substrate onto the first absorption layer to create a modified layer.
- The final process separates the first and second substrates using the modified layer as a starting point.
Key Features and Innovation: - The method involves the use of specific absorption layers to manipulate laser light for substrate processing. - The process of creating a modified layer allows for efficient separation of substrates. - The use of laser light in this manner enhances precision and control in substrate processing.
Potential Applications: - This technology can be applied in the manufacturing of electronic devices, solar panels, and other high-precision components. - It can also be used in the production of flexible displays, sensors, and microelectronics.
Problems Solved: - This method addresses the challenge of separating laminated substrates without damaging the layers. - It provides a precise and controlled way to process substrates for various applications.
Benefits: - Improved efficiency and accuracy in substrate processing. - Enhanced control over the separation of laminated substrates. - Potential for cost savings and increased productivity in manufacturing processes.
Commercial Applications: - The technology can be utilized in the electronics industry for the production of advanced devices. - It has potential applications in the renewable energy sector for manufacturing solar panels.
Questions about the technology: 1. How does the use of specific absorption layers impact the efficiency of laser light manipulation in substrate processing? 2. What are the potential cost-saving benefits of implementing this method in manufacturing processes?
Original Abstract Submitted
The substrate processing method includes processes (A) to (D). The process (A) prepares a laminated substrate including a first substrate, a first absorption layer that absorbs laser light, a second absorption layer having an absorption coefficient with respect to the laser light higher than that of the first absorption layer, a device layer, and a second substrate in this order. The process (B) irradiates the laser light with respect to the first substrate from a side opposite to the second substrate. The process (C) irradiates the laser light transmitted through the first substrate on the first absorption layer, to form a modified layer in the first absorption layer. The process (D) separates the first substrate and the second substrate from each other using the modified layer as a starting point.
