18561297. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)

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DISPLAY PANEL AND DISPLAY DEVICE

Organization Name

BOE Technology Group Co., Ltd.

Inventor(s)

Bin Wan of Beijing (CN)

Xiaoyuan Wang of Beijing (CN)

Junhui Wu of Beijing (CN)

Junming Chen of Beijing (CN)

Guodong Yang of Beijing (CN)

Xiaoshuang Zheng of Beijing (CN)

Zhicheng Fan of Beijing (CN)

DISPLAY PANEL AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18561297 titled 'DISPLAY PANEL AND DISPLAY DEVICE

The abstract describes a display panel comprising a display substrate with a display region and a peripheral region, including a bonding region. The display substrate has fanout lines and first bonding electrodes in the peripheral region. A drive chip with output pins bonded to the first bonding electrodes is also included.

  • Display panel with display and peripheral regions
  • Peripheral region includes bonding region
  • Display substrate with fanout lines and first bonding electrodes
  • Drive chip with output pins bonded to first bonding electrodes

Potential Applications: - Consumer electronics - Automotive displays - Medical devices

Problems Solved: - Improved connectivity between display substrate and drive chip - Enhanced display performance

Benefits: - Higher quality display output - Increased reliability and durability - Simplified manufacturing process

Commercial Applications: - Display technology for smartphones, tablets, and laptops - Automotive infotainment systems - Medical imaging devices

Questions about the technology: 1. How does this display panel improve overall display performance? 2. What are the specific advantages of using fanout lines and first bonding electrodes in the peripheral region?

Frequently Updated Research: - Ongoing advancements in display panel technology - Research on improving connectivity between display substrates and drive chips


Original Abstract Submitted

A display panel includes: a display substrate, including a display region and a peripheral region located outside the display region. The peripheral region includes a bonding region; the display substrate specifically includes a base substrate, a plurality of fanout lines located on one side of the base substrate in the peripheral region and extending to the bonding region, and a plurality of first bonding electrodes electrically connected with the fanout lines in one-to-one correspondence in the bonding region; a drive chip, including a drive chip body and a plurality of pins located on a side of the drive chip body facing the display substrate; wherein the plurality of pins include a plurality of output pins bonded with the first bonding electrodes in one-to-one correspondence.