18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
Contents
CIRCUITRY PACKAGE FOR POWER APPLICATIONS
Organization Name
Telefonaktiebolaget LM Ericsson (publ)
Inventor(s)
David Sychaleun of Ottawa (CA)
Igor Acimovic of Gatineau (CA)
CIRCUITRY PACKAGE FOR POWER APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18560149 titled 'CIRCUITRY PACKAGE FOR POWER APPLICATIONS
The abstract describes a patent application for a circuitry package positioned on a printed circuit board (PCB) with a heat sink provided. The circuitry package includes a body portion with a first surface, leads on a logical plane affixed to the first surface for contact with the PCB, and a central paddle for supporting transistor dies and acting as a thermal interface with the heat sink.
- Circuitry package positioned on a PCB with a heat sink provided
- Body portion with a first surface and leads on a logical plane for contact with the PCB
- Central paddle affixed to the body portion for supporting transistor dies and acting as a thermal interface with the heat sink
- Innovative design to improve thermal management and performance of electronic components
- Potential to enhance the reliability and longevity of electronic devices
Potential Applications: - Electronic devices requiring efficient thermal management - High-performance computing systems - Automotive electronics - Industrial control systems - Aerospace applications
Problems Solved: - Improved thermal dissipation for electronic components - Enhanced reliability and longevity of electronic devices - Better performance under high temperature conditions
Benefits: - Increased efficiency and performance of electronic devices - Extended lifespan of electronic components - Reduced risk of overheating and component failure
Commercial Applications: Title: Enhanced Thermal Management Technology for Electronic Devices Potential commercial uses include: - Consumer electronics - Telecommunications equipment - Medical devices - Military and defense systems - Data centers
Questions about Enhanced Thermal Management Technology for Electronic Devices: 1. How does this technology compare to traditional thermal management solutions? This technology offers improved thermal dissipation and performance compared to traditional methods by utilizing a central paddle as a thermal interface with the heat sink.
2. What are the potential cost savings associated with implementing this technology? Implementing this technology can lead to cost savings by reducing the need for additional cooling systems and extending the lifespan of electronic components.
Original Abstract Submitted
According to one or more embodiments, a circuitry package is positioned on a printed circuit board, (PCB) and a heat sink is provided. The circuitry package includes a body portion having a first surface, and a plurality of leads on a logical plane and affixed on the first surface of the body portion where the plurality of leads are positionable to make contact with the PCB. The circuitry package includes a central paddle affixed to the body portion and extending in a direction substantially perpendicular to the logical plane where the central paddle is configured to support at least one transistor die near the logical plane and act as a thermal interface between the at least one transistor die and the heat sink.
