18559516. HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract (Mitsubishi Electric Corporation)
Contents
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Hiroaki Minamide of Tokyo (JP)
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18559516 titled 'HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
The patent application describes a semiconductor chip assembly with input and output feedthroughs wire-connected to pads on the substrate, a metal seal ring electrically connected to a metal plate, and a conductive cap covering the semiconductor chip.
- The input and output feedthroughs are connected to the semiconductor chip pads for data transfer.
- The metal seal ring is connected to the metal plate through a through-hole for electrical continuity.
- A conductive cap is bonded to the metal seal ring and covers the semiconductor chip, providing protection.
- An isolation metal wire partitions the inner space, separating the input and output regions.
- The isolation metal wire creates an isolation wall to prevent interference between the input and output signals.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Communication devices
Problems Solved: - Ensuring proper electrical connections in semiconductor chip assemblies - Preventing interference between input and output signals
Benefits: - Improved signal transmission efficiency - Enhanced protection for semiconductor chips - Reduced risk of signal interference
Commercial Applications: Title: Advanced Semiconductor Chip Assembly for Enhanced Signal Transmission This technology can be used in various electronic devices, communication systems, and semiconductor manufacturing processes to improve signal transmission efficiency and protect semiconductor chips.
Questions about the technology: 1. How does the metal seal ring contribute to the overall functionality of the semiconductor chip assembly? The metal seal ring provides electrical connection and protection for the semiconductor chip, enhancing its performance and durability.
2. What is the significance of the isolation metal wire in partitioning the inner space of the assembly? The isolation metal wire helps prevent signal interference between the input and output regions, ensuring reliable data transmission.
Original Abstract Submitted
An input feedthrough () and an output feedthrough () provided on the substrate () are wire-connected to an input pad () and an output pad () of the semiconductor chip () respectively. A metal seal ring () is provided on the substrate () is electrically connected to the metal plate () by a through-hole (). A conductive cap () is bonded to the metal seal ring () and covers a place above the semiconductor chip (). Both ends of an isolation metal wire () are electrically connected to the metal plate () and a loop comes into contact with a lower surface of the conductive cap (). The isolation metal wire () constitutes an isolation wall partitioning an inner space into a region including the input feedthrough () and a region including the output feedthrough ().
