18559153. Electronic Control Device simplified abstract (Hitachi Astemo, Ltd.)
Contents
Electronic Control Device
Organization Name
Inventor(s)
Yoshio Kawai of Hitachinaka (JP)
Keiko Ueno of Hitachinaka (JP)
Electronic Control Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18559153 titled 'Electronic Control Device
The abstract describes an electronic control device that achieves high heat dissipation and solder connection reliability. The device includes a circuit board with an electronic component and a connector, a base housing the circuit board, a cover closing the base, a heat dissipation pedestal on the base, and a thermally conductive material on the upper surface of the pedestal. Grooves are formed on the upper surface of the pedestal to allow the thermally conductive material to enter. The electronic component is in contact with the heat dissipation pedestal via the thermally conductive material.
- Heat dissipation pedestal with thermally conductive material
- Grooves on the pedestal for thermally conductive material entry
- Electronic component in contact with the pedestal for heat dissipation
- Achieves high heat dissipation and solder connection reliability
- Circuit board with electronic component and connector
Potential Applications: - Electronic control devices - High heat dissipation applications - Solder connection reliability in electronic components
Problems Solved: - Overheating of electronic components - Poor solder connection reliability
Benefits: - Improved heat dissipation - Enhanced solder connection reliability - Increased longevity of electronic components
Commercial Applications: - Electronics manufacturing industry - Automotive electronics - Aerospace technology
Questions about the technology: 1. How does the heat dissipation pedestal improve the performance of the electronic control device? 2. What are the potential implications of using thermally conductive material in electronic components?
Frequently Updated Research: - Ongoing studies on improving heat dissipation in electronic devices - Research on new materials for enhancing solder connection reliability.
Original Abstract Submitted
An electronic control device capable of achieving both high heat dissipation and solder connection reliability is achieved. An electronic control device includes a circuit board mounted with an electronic component and a connector , a base housing this circuit board , a cover closing this base , a heat dissipation pedestal formed on the base , and a thermally conductive material arranged on an upper surface of this heat dissipation pedestal . On the upper surface of the heat dissipation pedestal on which the thermally conductive material is arranged, a plurality of grooves formed radially from the center of the upper surface of the heat dissipation pedestal and where the thermally conductive material enters are formed. The electronic component is configured to be in contact with the heat dissipation pedestal via the thermally conductive material . This can achieve an electronic control device capable of achieving both high heat dissipation and solder connection reliability.
