18558782. DECOUPLING DEVICE AND DECOUPLING METHOD simplified abstract (ZTE Corporation)
Contents
DECOUPLING DEVICE AND DECOUPLING METHOD
Organization Name
Inventor(s)
DECOUPLING DEVICE AND DECOUPLING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18558782 titled 'DECOUPLING DEVICE AND DECOUPLING METHOD
The abstract describes a decoupling device and method for an antenna array, consisting of a dielectric substrate with first, second, and third decoupling units arranged on it.
- The decoupling device is designed for an antenna array with multiple antenna elements.
- It includes a dielectric substrate positioned above the antenna elements.
- First decoupling units are placed on the substrate, above the middle position between every two E-plane coupled antenna elements.
- Second decoupling units are also on the substrate, above each antenna element.
- Third decoupling units are arranged on the substrate, above the middle position between every two H-plane coupled antenna elements.
Potential Applications: - Wireless communication systems - Radar systems - Satellite communication systems
Problems Solved: - Minimizing interference between antenna elements - Improving overall antenna performance
Benefits: - Enhanced signal quality - Increased antenna efficiency - Reduced signal distortion
Commercial Applications: Title: "Advanced Decoupling Device for Antenna Arrays" This technology can be utilized in various industries such as telecommunications, aerospace, and defense for improved signal transmission and reception.
Questions about the technology: 1. How does the decoupling device improve the performance of antenna arrays? 2. What are the key advantages of using this decoupling method in wireless communication systems?
Original Abstract Submitted
A decoupling device and a decoupling method are disclosed. The decoupling device is applied to an antenna array which may include a plurality of antenna elements. The decoupling device may include: a dielectric substrate () located above the antenna elements; first decoupling units () arranged on the dielectric substrate (), each first decoupling unit () being located above a middle position between every two E-plane coupled antenna elements; second decoupling units () arranged on the dielectric substrate (), the second decoupling units () being located above each antenna element; and third decoupling units () arranged on the dielectric substrate (), each third decoupling unit () being located above a middle position between every two H-plane coupled antenna elements.
