18557329. ULTRA-LIGHT EPOXY COMPOSITION simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
Contents
ULTRA-LIGHT EPOXY COMPOSITION
Organization Name
3M INNOVATIVE PROPERTIES COMPANY
Inventor(s)
Sohaib Elgimiabi of Duesseldorf (DE)
ULTRA-LIGHT EPOXY COMPOSITION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18557329 titled 'ULTRA-LIGHT EPOXY COMPOSITION
The abstract of this patent application describes a low-density curable composition precursor that includes polymeric diamines, epoxy resin, reactive diluent, and amides selected from polyamide waxes. The composition also contains a low-density filler material, resulting in a cured density of less than 0.5 g/cc.
- Polymeric diamines, epoxy resin, reactive diluent, and amides are key components of the composition.
- The composition includes a low-density filler material with a density of less than 0.3 g/cc.
- The cured density of the composition is less than 0.5 g/cc according to DIN 53479A.
Potential Applications: - Aerospace industry for lightweight materials - Automotive industry for fuel efficiency - Electronics industry for insulation materials
Problems Solved: - Providing a lightweight curable composition - Achieving low cured density for various applications
Benefits: - Improved fuel efficiency - Enhanced insulation properties - Reduced overall weight in applications
Commercial Applications: Title: Lightweight Curable Composition for Various Industries This technology can be used in aerospace, automotive, and electronics industries for lightweight, durable materials.
Questions about the technology: 1. How does the low-density filler material impact the overall properties of the composition? 2. What are the specific advantages of using polymeric diamines in this curable composition?
Original Abstract Submitted
In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one epoxy resin; (ii) at least one reactive diluent; (iii) at least one amide selected from polyamide waxes; wherein part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc.
