18556265. POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
Contents
POWER MODULE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18556265 titled 'POWER MODULE
The present disclosure pertains to a power module with multiple semiconductor elements allowing a main current to flow in a thickness direction, mounted on a substrate which is then placed on a base plate. A case is bonded to the base plate to enclose the semiconductor elements. Main wiring boards are located in the upper part of the case, opposite the base plate, running parallel to it. Wires are connected to the lower surfaces of the main wiring boards, facing the semiconductor elements, to link the upper surface electrodes of the semiconductor elements to the main wiring boards using a bonding material.
- Power module design with semiconductor elements for current flow.
- Substrate and base plate for mounting the semiconductor elements.
- Case housing the semiconductor elements, bonded to the base plate.
- Main wiring boards in the upper part of the case, parallel to the base plate.
- Wires connecting the semiconductor elements to the main wiring boards.
Potential Applications: - Power electronics - Renewable energy systems - Electric vehicles - Industrial automation - Consumer electronics
Problems Solved: - Efficient current flow management - Compact design for space-saving - Enhanced thermal management - Improved reliability and durability
Benefits: - Higher power efficiency - Reduced size and weight - Enhanced performance and reliability - Simplified assembly and maintenance
Commercial Applications: The technology can be utilized in various industries such as power electronics, renewable energy, electric vehicles, industrial automation, and consumer electronics for improved performance and efficiency.
Questions about Power Module Technology: 1. How does the design of the power module contribute to better thermal management? 2. What are the key advantages of using main wiring boards in the upper part of the case?
Frequently Updated Research: Ongoing research focuses on optimizing the bonding materials used in connecting the semiconductor elements to the main wiring boards for improved performance and reliability.
Original Abstract Submitted
The present disclosure relates to a power module including a plurality of semiconductor elements through which a main current flows in a thickness direction; a substrate on which the plurality of semiconductor elements are mounted; a base plate on which the substrate is mounted; a case that is bonded to the base plate and houses the plurality of semiconductor elements; a plurality of main wiring boards incorporated in an upper portion of the case on a side opposite to the base plate and arranged in parallel to the base plate; and a plurality of wires bonded to lower surfaces of the plurality of main wiring boards that face the plurality of semiconductor elements, in which an upper surface electrode of each of the plurality of semiconductor elements is electrically connected to a corresponding one of the plurality of main wiring boards with the plurality of wires and a bonding material.
