18555432. GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND OPERATION METHOD FOR GAS SUPPLY SYSTEM simplified abstract (Tokyo Electron Limited)

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GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND OPERATION METHOD FOR GAS SUPPLY SYSTEM

Organization Name

Tokyo Electron Limited

Inventor(s)

Eiichi Sugawara of Kurokawa-gun, Miyagi (JP)

GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND OPERATION METHOD FOR GAS SUPPLY SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18555432 titled 'GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND OPERATION METHOD FOR GAS SUPPLY SYSTEM

The disclosed gas supply system includes a gas supply line and a gas recovery line. The gas supply line supplies a heat transfer gas to a gap between a substrate support and a back surface of a substrate. The gas supply line includes first to third portions and a pressure controller. The second portion extends downstream of the first portion. The pressure controller regulates a pressure of the heat transfer gas and is connected between the first portion and the second portion. The third portion connects the second portion and the gap. The gas recovery line is connected to the first and second portions. The gas recovery line includes a pump connected between the first and the second portions. The gas recovery line shares the third portion with the gas supply line. The gas recovery line returns the heat transfer gas from the second portion to the first portion.

  • The gas supply system includes a gas supply line and a gas recovery line.
  • The gas supply line supplies a heat transfer gas to a gap between a substrate support and a back surface of a substrate.
  • The gas supply line has first to third portions and a pressure controller to regulate the gas pressure.
  • The gas recovery line is connected to the first and second portions and includes a pump to return the gas from the second portion to the first portion.
  • The gas recovery line shares the third portion with the gas supply line.

Potential Applications: - Semiconductor manufacturing processes - Solar panel production - Thin film deposition in electronics industry

Problems Solved: - Efficient heat transfer gas supply - Controlled pressure regulation - Gas recovery for sustainability

Benefits: - Improved process efficiency - Enhanced substrate cooling - Reduced gas wastage

Commercial Applications: Title: Gas Supply System for Semiconductor Manufacturing This technology can be used in semiconductor manufacturing processes to enhance heat transfer efficiency and substrate cooling, leading to improved production yields and cost savings.

Prior Art: Prior research on gas supply systems in semiconductor manufacturing processes can provide insights into the development and optimization of similar technologies.

Frequently Updated Research: Ongoing research on gas supply systems in various industries may provide new advancements and applications for this technology.

Questions about Gas Supply Systems: 1. How does the gas recovery line contribute to the overall efficiency of the system? 2. What are the potential challenges in implementing this gas supply system in large-scale manufacturing operations?


Original Abstract Submitted

A disclosed gas supply system includes a gas supply line and a gas recovery line. The gas supply line supplies a heat transfer gas to a gap between a substrate support and a back surface of a substrate. The gas supply line includes first to third portions and a pressure controller. The second portion extends downstream of the first portion. The pressure controller regulates a pressure of the heat transfer gas and is connected between the first portion and the second portion. The third portion connects the second portion and the gap. The gas recovery line is connected to the first and second portions. The gas recovery line includes a pump connected between the first and the second portions. The gas recovery line shares the third portion with the gas supply line. The gas recovery line returns the heat transfer gas from the second portion to the first portion.