18554244. SEMICONDUCTOR DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)

SEMICONDUCTOR DEVICE

Organization Name

SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor(s)

Mitsuru Adachi of Kanagawa (JP)

Toshihiro Murayama of Kanagawa (JP)

Ryo Inomoto of Kanagawa (JP)

Hirohisa Yasukawa of Kanagawa (JP)

Yuki Suda of Kanagawa (JP)

Masaki Hatano of Kanagawa (JP)

Toshiki Koyama of Kanagawa (JP)

Harumi Miyaki of Kanagawa (JP)

Kiyohisa Sakai of Kanagawa (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18554244 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

A semiconductor device is enhanced with a heat conductive member to improve reliability. This device includes a semiconductor chip, a heat dissipation member, a heat conductive member, and an outflow prevention part. The heat conductive member is placed between the heat dissipation member and the chip plane of the semiconductor chip to prevent heat outflow.

• The semiconductor device includes a heat conductive member to enhance reliability.
• The heat conductive member is positioned between the heat dissipation member and the semiconductor chip.
• An outflow prevention part is included to stop the heat conductive member from flowing out of the chip plane.

Potential Applications

This technology can be applied in various semiconductor devices where reliability and heat dissipation are crucial, such as in computer processors, power electronics, and LED lighting systems.

Problems Solved

This innovation addresses the issue of heat dissipation and reliability in semiconductor devices by effectively managing the flow of heat within the device.

Benefits

- Improved reliability of semiconductor devices - Enhanced heat dissipation capabilities - Prevention of heat outflow from the chip plane

Commercial Applications

Title: Enhanced Semiconductor Devices with Heat Conductive Member This technology can be utilized in the manufacturing of high-performance electronic devices, leading to more efficient and reliable products in industries such as telecommunications, automotive, and consumer electronics.

Prior Art

Readers can explore prior research on heat dissipation techniques in semiconductor devices, as well as studies on improving reliability through innovative design elements.

Frequently Updated Research

Stay updated on the latest advancements in heat management technologies for semiconductor devices to ensure optimal performance and reliability.

Questions about Semiconductor Devices with Heat Conductive Member

What are the key benefits of using a heat conductive member in semiconductor devices?

The key benefits include improved reliability, enhanced heat dissipation, and prevention of heat outflow, leading to better overall performance.

How does the outflow prevention part contribute to the reliability of semiconductor devices?

The outflow prevention part ensures that the heat conductive member remains in place, preventing any disruptions in the heat dissipation process.

Original Abstract Submitted

Reliability is improved in a semiconductor device using a heat conductive member. The semiconductor device includes a first semiconductor chip, a heat dissipation member, a heat conductive member, and an outflow prevention part. In a semiconductor package including the first semiconductor chip, the heat dissipation member, the heat conductive member, and the outflow prevention part, the heat conductive member is disposed between the heat dissipation member and the chip plane of the first semiconductor chip. The outflow prevention part prevents the outflow of the heat conductive member from the chip plane of the first semiconductor chip.