18553885. MARK HOLE POSITIONING METHOD AND APPARATUS, ASSEMBLY DEVICE, AND STORAGE MEDIUM simplified abstract (HONOR DEVICE CO., LTD.)

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MARK HOLE POSITIONING METHOD AND APPARATUS, ASSEMBLY DEVICE, AND STORAGE MEDIUM

Organization Name

HONOR DEVICE CO., LTD.

Inventor(s)

Xi Cheng of Shenzhen (CN)

MARK HOLE POSITIONING METHOD AND APPARATUS, ASSEMBLY DEVICE, AND STORAGE MEDIUM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18553885 titled 'MARK HOLE POSITIONING METHOD AND APPARATUS, ASSEMBLY DEVICE, AND STORAGE MEDIUM

Simplified Explanation

The patent application describes a method for positioning mark holes using image processing techniques.

Key Features and Innovation

  • Obtaining a target image with a mark hole to be positioned.
  • Extracting contour points of the mark hole from the image.
  • Generating auxiliary circles using the contour points as centers.
  • Traversing each circle center and radius value to create multiple auxiliary circles.
  • Determining sub-pixel positioning information for accurate mark hole placement.

Potential Applications

This technology can be used in industries that require precise positioning of components, such as manufacturing, robotics, and quality control.

Problems Solved

The method addresses the challenge of accurately positioning mark holes with sub-pixel precision, improving overall assembly and alignment processes.

Benefits

  • Enhanced accuracy in mark hole positioning.
  • Increased efficiency in assembly processes.
  • Reduction of errors and rework in component alignment.

Commercial Applications

  • Precision manufacturing processes.
  • Automated assembly systems.
  • Quality control in production lines.

Prior Art

There may be prior art related to image processing techniques for mark hole positioning, but the specific method described in this patent application may offer unique features and improvements.

Frequently Updated Research

There may be ongoing research in the field of image processing for precise component positioning that could impact the development of this technology.

Questions about Mark Hole Positioning

Question 1

How does the method ensure accurate sub-pixel positioning of mark holes?

Answer 1

The method uses auxiliary circles and pixel intersection analysis to determine the precise sub-pixel position of the mark hole.

Question 2

What industries can benefit the most from this technology?

Answer 2

Industries such as manufacturing, robotics, and quality control can benefit from the improved accuracy and efficiency in component positioning offered by this technology.


Original Abstract Submitted

A mark hole positioning method is provided. The assembly device obtains a target image including a to-be-positioned mark hole, and extracts contour points of the mark hole from the target image. Next, the assembly device generates a circle center set of auxiliary circles by using the contour points as circle centers of the auxiliary circles. Then, the assembly device traverses each circle center in the circle center set and each radius value in a radius set, generates a plurality of auxiliary circles in the target image, and accumulates, for different radius values, a quantity of times of intersection between pixels in the target image and the plurality of auxiliary circles. Finally, sub-pixel positioning information of the mark hole is determined and the mark hole is positioned based on the sub-pixel positioning information of the mark hole.