18552197. CUTOFF DEVICE simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
Contents
CUTOFF DEVICE
Organization Name
Panasonic Intellectual Property Management Co., Ltd.
Inventor(s)
CUTOFF DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18552197 titled 'CUTOFF DEVICE
Simplified Explanation
The patent application describes a disconnect device with multiple relays and heat transfer parts for efficient heat dissipation.
- The device includes a heatsink, a substrate, first and second charging relays, first and second discharging relays, and first and second power storage ends.
- The discharging relays are closer to the power storage ends than the charging relays.
- The heat transfer parts are aligned in different directions for optimal heat dissipation performance.
Potential Applications
This technology could be applied in various electronic devices where efficient heat dissipation is crucial, such as power inverters, battery management systems, and electric vehicle charging stations.
Problems Solved
1. Overheating issues in electronic devices due to inefficient heat dissipation. 2. Ensuring the safety and longevity of electronic components by maintaining optimal operating temperatures.
Benefits
1. Improved performance and reliability of electronic devices. 2. Enhanced safety by preventing overheating and potential damage to components. 3. Increased efficiency in energy storage and transfer processes.
Potential Commercial Applications
Optimizing heat dissipation in electronic devices can benefit industries such as renewable energy, electric vehicles, and consumer electronics, leading to more reliable and durable products.
Possible Prior Art
Prior art in the field of heat dissipation technologies for electronic devices may include similar disconnect devices with multiple relays and heat transfer parts, but the specific configuration and alignment described in this patent application may be unique.
Unanswered Questions
How does this technology compare to existing heat dissipation solutions in terms of cost-effectiveness and scalability?
This article does not provide information on the cost implications or scalability of implementing this technology compared to other heat dissipation solutions.
What impact could this technology have on the overall energy efficiency of electronic devices?
The article does not address the potential energy savings or efficiency improvements that could result from implementing this heat dissipation technology.
Original Abstract Submitted
A disconnect device includes a heatsink, a substrate, a first charging relay disposed on a first heat transfer part, a second charging relay disposed on a second heat transfer part, a first discharging relay disposed on a third heat transfer part, a second discharging relay disposed on a fourth heat transfer part, and first and second power storage ends. The first and second discharging relays are disposed closer to the first and second power storage ends than the first and second charging relays are. The first, second, third, and fifth heat transfer parts are aligned in a first direction. The fourth and fifth heat transfer parts are aligned in a second direction perpendicular to the first direction. A heat dissipating performance of the heatsink on the third, fourth, and fifth heat transfer parts is higher than a heat dissipating performance of the heatsink on the first and second heat transfer parts.
