18551287. PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD simplified abstract (Tokyo Electron Limited)
Contents
- 1 PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
Organization Name
Inventor(s)
Tadashi Obikane of Yamanashi (JP)
Fumito Kagami of Yamanashi (JP)
PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18551287 titled 'PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
Simplified Explanation
The processing apparatus described in the patent application includes a pick, first and second suction pads for different types of substrates, a pressure sensor, and a controller for controlling suction operations based on pressure readings.
- The pick is used to hold and transfer substrates.
- The first suction pad is for concavely curved substrates, while the second suction pad is for convexly curved substrates.
- The pressure sensor detects pressure in the suction paths connected to the suction pads.
- The controller adjusts suction operations based on pressure sensor readings.
Potential Applications
This technology could be applied in industries that require precise handling of substrates with different curvature types, such as semiconductor manufacturing or optical lens production.
Problems Solved
This technology solves the problem of efficiently and accurately handling substrates with varying curvatures, which can be challenging with traditional processing methods.
Benefits
The benefits of this technology include improved substrate handling accuracy, reduced risk of damage, and increased efficiency in processing operations.
Potential Commercial Applications
A potential commercial application for this technology could be in the production of curved glass for automotive windshields or curved displays for electronic devices.
Possible Prior Art
One possible prior art for this technology could be robotic arms with interchangeable end effectors for handling different types of substrates, but the specific design with separate suction pads for concave and convex substrates appears to be a novel feature.
Unanswered Questions
How does this technology compare to traditional substrate handling methods?
This article does not provide a direct comparison between this technology and traditional substrate handling methods. It would be interesting to know the efficiency and accuracy improvements, if any, compared to existing methods.
What are the potential limitations or challenges of implementing this technology in different industrial settings?
The article does not address any potential limitations or challenges that may arise when implementing this technology in various industrial settings. It would be important to understand any constraints or adaptations required for different applications.
Original Abstract Submitted
A processing apparatus according to an aspect of the present disclosure includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a convexly curved substrate, a pressure sensor configured to detect a pressure in a first suction path connected to the first suction pad and a pressure in a second suction path connected to the second suction pad, and a controller configured to control suction operations by the first suction pad and the second suction pad based on a detection value of the pressure sensor.
