18550726. SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Contents
- 1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Organization Name
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor(s)
Takayuki Tanaka of Kanagawa (JP)
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18550726 titled 'SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Simplified Explanation
The semiconductor device described in the patent application is designed to suppress a temperature rise of a semiconductor element and to prevent warpage. The device includes a semiconductor element adhered to a substrate, with a cooling medium filling the clearance formed between them. The cooling medium can be a liquid metal, a metal-coated small sphere, or a combination of both, and it helps transmit heat generated by the semiconductor element to the outside, thereby reducing temperature rise.
- Semiconductor device designed to suppress temperature rise and warpage
- Cooling medium (liquid metal or metal-coated small sphere) fills clearance between semiconductor element and substrate
- Cooling medium helps transmit heat generated by semiconductor element to the outside
Potential Applications
The technology described in this patent application could be applied in various electronic devices where temperature management is crucial, such as high-performance computers, servers, and power electronics.
Problems Solved
This technology addresses the issue of temperature rise in semiconductor devices, which can lead to performance degradation and even failure. By efficiently dissipating heat, the device can operate at optimal temperatures, improving reliability and longevity.
Benefits
- Improved thermal management - Reduced risk of overheating and performance degradation - Enhanced reliability and longevity of semiconductor devices
Potential Commercial Applications
"Thermal Management Solutions for Electronic Devices"
Possible Prior Art
One possible prior art could be the use of traditional heat sinks or fans for cooling semiconductor devices. However, the use of liquid metal or metal-coated small spheres as a cooling medium in the specific configuration described in this patent application may be a novel approach to address temperature rise and warpage in semiconductor devices.
Unanswered Questions
How does the cooling medium affect the overall size and weight of the semiconductor device?
The article does not provide information on how the cooling medium impacts the size and weight of the semiconductor device. This could be important for applications where space and weight constraints are critical factors.
What are the potential challenges or limitations of using liquid metal or metal-coated small spheres as a cooling medium in semiconductor devices?
The article does not discuss any challenges or limitations that may arise from using liquid metal or metal-coated small spheres as a cooling medium. Understanding these factors could provide a more comprehensive view of the technology's feasibility and practicality.
Original Abstract Submitted
Provided are a semiconductor device configured to suppress a temperature rise of a semiconductor element and to suppress warpage, a method for manufacturing the semiconductor device including a cooling medium sealing step, and an electronic apparatus including the semiconductor device. The semiconductor device includes: a semiconductor element; a substrate to which the semiconductor element is adhered; and a cooling medium with which a clearance formed when the semiconductor element and the substrate are adhered to each other with an adhesive is filled. The cooling medium is a liquid metal, a metal-coated small sphere, or a liquid metal and a metal-coated small sphere. The cooling medium transmits heat generated by the semiconductor element to the outside to suppress a temperature rise.
