18550317. ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE simplified abstract (PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.)
ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
Organization Name
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Inventor(s)
Tadahiko Sakai of Fukuoka (JP)
Shingo Okamura of Fukuoka (JP)
ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18550317 titled 'ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
Simplified Explanation: The patent application describes an adhesive used to temporarily attach an electronic component to a solder precoat covered with an organic film. The adhesive contains a principal resin and a solvent that dissolves the resin. The solvent content ranges from 25% to 40% by mass, and the organic film dissolves in the solvent when the solder precoat melts.
Key Features and Innovation:
- Adhesive for fixing electronic components to solder precoat covered with organic film
- Contains principal resin and solvent
- Solvent content between 25% and 40% by mass
- Organic film dissolves in the solvent when solder precoat melts
Potential Applications:
- Electronics manufacturing
- Circuit board assembly
- Soldering processes
Problems Solved:
- Suppression of oxide film formation on solder precoat surface
- Prevention of poor connection between electrode and electronic component
Benefits:
- Improved adhesion of electronic components
- Enhanced soldering process reliability
- Reduced risk of poor connections
Commercial Applications:
- Electronics industry for manufacturing and assembly processes
- Soldering equipment manufacturers
- Suppliers of electronic components
Prior Art: Prior art related to this technology may include patents or research on adhesives for electronic components in soldering processes, as well as studies on the impact of organic films on solder precoat surfaces.
Frequently Updated Research: Researchers may be exploring new formulations for adhesives in electronics manufacturing, as well as studying the effects of different solvents on organic films in soldering processes.
Questions about Adhesive for Electronic Components: 1. What are the specific characteristics of the principal resin used in the adhesive? 2. How does the solvent content in the adhesive affect its performance in attaching electronic components?
Original Abstract Submitted
An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.
