18550067. MULTILAYER CERAMIC COMPONENT simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)

MULTILAYER CERAMIC COMPONENT

Organization Name

Panasonic Intellectual Property Management Co., Ltd.

Inventor(s)

Yuto Akiyama of Hokkaido (JP)

Sayaka Watanabe of Hokkaido (JP)

Yuji Yamagishi of Hokkaido (JP)

MULTILAYER CERAMIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18550067 titled 'MULTILAYER CERAMIC COMPONENT

Simplified Explanation

The multilayer ceramic component described in the abstract consists of a sintered body, internal electrodes, and a side surface electrode. The side surface electrode includes a primary electrode layer with silver as the main component and a plating layer that partially covers the primary electrode layer. The primary electrode layer has a first terminal portion for the side surface of the sintered body and a second terminal portion that extends in a second direction from at least one end portion of the first terminal portion in a third direction, provided for the principal surfaces. An interposed portion is formed by allowing a part of the plating layer to enter a region where the tip of the second terminal portion and the sintered body are separate.

• The multilayer ceramic component includes a primary electrode layer with silver as the main component, providing excellent conductivity.
• The plating layer covering the primary electrode layer enhances the durability and stability of the side surface electrode.
• The design of the second terminal portion extending from the first terminal portion allows for efficient connection to the principal surfaces of the sintered body.

Potential Applications

The technology described in this patent application could be applied in electronic devices, such as capacitors, sensors, and filters.

Problems Solved

This technology solves the problem of ensuring reliable electrical connections in multilayer ceramic components, improving their overall performance and longevity.

Benefits

The benefits of this technology include enhanced conductivity, improved durability, and stable electrical connections in electronic devices.

Potential Commercial Applications

The technology could be commercially applied in the manufacturing of electronic components for various industries, including telecommunications, automotive, and consumer electronics.

Possible Prior Art

One possible prior art could be the use of silver as a main component in electrode layers for ceramic components, but the specific design and structure described in this patent application may be novel.

How does this technology compare to traditional electrode designs in terms of performance and cost?

This article does not provide a direct comparison between this technology and traditional electrode designs in terms of performance and cost. Further research or testing may be needed to evaluate these aspects.

What are the potential challenges in implementing this technology on a large scale in manufacturing processes?

The article does not address the potential challenges in implementing this technology on a large scale in manufacturing processes. Factors such as scalability, production efficiency, and cost-effectiveness could be important considerations that need to be explored further.

Original Abstract Submitted

A multilayer ceramic component according to the present disclosure includes a sintered body, a plurality of internal electrodes, and a side surface electrode. The side surface electrode includes: a primary electrode layer containing silver as a main component thereof; and a plating layer covering the primary electrode layer at least partially. The primary electrode layer includes a first terminal portion provided for the side surface of the sintered body and a second terminal portion. The second terminal portion extends, in a second direction, from at least one of a pair of end portions of the first terminal portion in a third direction and is provided for at least one of a pair of principal surfaces. An interposed portion is formed by allowing a part of the plating layer to enter a region where a tip of the second terminal portion and the sintered body are separate from each other.