18549063. POWER MODULE WITH A CERAMIC CIRCUIT CARRIER, A FLEXIBLE CIRCUIT BOARD AND A TEMPERATURE SENSOR simplified abstract (Robert Bosch GmbH)

POWER MODULE WITH A CERAMIC CIRCUIT CARRIER, A FLEXIBLE CIRCUIT BOARD AND A TEMPERATURE SENSOR

Organization Name

Robert Bosch GmbH

Inventor(s)

Sebastian Strache of Wannweil (DE)

Christoph Friederich of Reutlingen (DE)

Dominik Ruoff of St. Johann (DE)

Frank Zander of Rottenburg Am Neckar (DE)

Tatiana Barsukova of Riederich (DE)

Tobias Zahn of Rottenburg (DE)

POWER MODULE WITH A CERAMIC CIRCUIT CARRIER, A FLEXIBLE CIRCUIT BOARD AND A TEMPERATURE SENSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 18549063 titled 'POWER MODULE WITH A CERAMIC CIRCUIT CARRIER, A FLEXIBLE CIRCUIT BOARD AND A TEMPERATURE SENSOR

Simplified Explanation

The abstract describes a power module, specifically a commutation cell for an inverter, which includes a circuit carrier, semiconductor switches, a flexible circuit board, and a temperature sensor.

• The power module consists of a ceramic circuit carrier and semiconductor switch half-bridge with two power semiconductor switches.
• The semiconductor switches are integrally connected to the circuit carrier.
• A flexible circuit board is also integrally connected to the circuit carrier and is located in the area of the semiconductor switches.
• The power module includes a temperature sensor that is connected to the flexible circuit board and is designed to sense the temperature of the circuit carrier and indirectly the temperature of the semiconductor switches.

Potential Applications

The technology described in this patent application could be applied in various industries such as power electronics, renewable energy systems, electric vehicles, and industrial automation.

Problems Solved

This technology solves the problem of efficiently monitoring and controlling the temperature of semiconductor switches in power modules, which is crucial for ensuring the reliability and performance of the inverter system.

Benefits

The integration of the temperature sensor with the flexible circuit board allows for accurate temperature sensing of the semiconductor switches, leading to improved thermal management and overall system efficiency.

Potential Commercial Applications

Potential commercial applications of this technology include inverter systems for solar power plants, electric vehicle drivetrains, wind turbines, and industrial motor drives.

Possible Prior Art

One possible prior art for this technology could be the use of external temperature sensors in power modules for monitoring semiconductor switch temperatures. However, the integration of the temperature sensor with the flexible circuit board in this invention is a novel approach to temperature sensing in power modules.

How does this technology compare to traditional temperature monitoring methods in power modules?

This technology offers a more integrated and accurate approach to temperature sensing compared to traditional methods that rely on external sensors. By directly sensing the temperature of the circuit carrier and semiconductor switches through the flexible circuit board, this innovation provides real-time data for better thermal management.

What are the potential challenges in implementing this technology in large-scale industrial applications?

One potential challenge could be ensuring the reliability and durability of the flexible circuit board and temperature sensor in harsh operating conditions. Additionally, integrating the temperature sensor with the circuit carrier and semiconductor switches may require specialized manufacturing processes, which could impact the cost and scalability of the technology.

Original Abstract Submitted

A power module, in particular a commutation cell for an inverter. The power module includes a circuit carrier, in particular a ceramic circuit carrier, and at least one or only one semiconductor switch half-bridge with two semiconductor switches, in particular power semiconductor switches, wherein the semiconductor switches are in particular integrally connected to the circuit carrier. The power module of the above-mentioned type includes a flexible circuit board, which is in particular integrally connected to the circuit carrier. The flexible circuit board is arranged in the area of the semiconductor switches. The power module comprises a temperature sensor, which is integrally connected to the flexible circuit board and is designed and arranged to sense a temperature of the circuit carrier in the area of the semiconductor switches, and in particular thus indirectly a temperature of the semiconductor switches, through the flexible circuit board.