18545996. STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AND RELATED METHODS, DEVICES, AND SYSTEMS simplified abstract (Micron Technology, Inc.)
STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AND RELATED METHODS, DEVICES, AND SYSTEMS
Organization Name
Inventor(s)
Seng Kim Dalson Ye of Singapore (SG)
Kelvin Tan Aik Boo of Singapore (SG)
See Hiong Leow of Singapore (SG)
STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AND RELATED METHODS, DEVICES, AND SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18545996 titled 'STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AND RELATED METHODS, DEVICES, AND SYSTEMS
The abstract of the patent application describes a microelectronic device package that includes a microelectronic device connected to a substrate. The package also includes a stack of semiconductor dies positioned above the microelectronic device, with an interposer placed between the microelectronic device and the stack of semiconductor dies. The interposer features a conductive structure that electrically connects the microelectronic device to a ground circuit of the substrate, as well as an insulative structure positioned between the conductive structure and the stack of semiconductor dies.
- The microelectronic device package includes a microelectronic device, a substrate, a stack of semiconductor dies, and an interposer.
- The interposer plays a crucial role in electrically connecting the microelectronic device to the ground circuit of the substrate.
- An insulative structure within the interposer ensures proper insulation between the conductive structure and the stack of semiconductor dies.
- This innovative packaging design enhances the electrical connectivity and insulation within the microelectronic device package.
- The technology aims to improve the overall performance and reliability of microelectronic devices.
Potential Applications: - This technology can be applied in various microelectronic devices such as smartphones, tablets, and computers. - It can also be used in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Enhances electrical connectivity within microelectronic device packages. - Improves insulation between components. - Increases overall performance and reliability of microelectronic devices.
Benefits: - Improved electrical performance. - Enhanced reliability. - Better overall functionality of microelectronic devices.
Commercial Applications: Title: Advanced Microelectronic Device Packaging Technology for Enhanced Performance This technology can be utilized in the consumer electronics industry, automotive sector, medical device manufacturing, and industrial automation.
Questions about Microelectronic Device Package Technology: 1. How does the interposer improve the electrical connectivity within the microelectronic device package? 2. What are the potential applications of this technology in different industries?
Original Abstract Submitted
A microelectronic device package includes a microelectronic device coupled to a substrate. The microelectronic device package further includes a stack of semiconductor dies positioned over the microelectronic device. The microelectronic device package also includes an interposer positioned between the microelectronic device and the stack of semiconductor dies. The interposer includes a conductive structure electrically connecting the microelectronic device and a ground circuit of the substrate. The interposer further includes an insulative structure positioned between the conductive structure and the stack of semiconductor dies.
