18545919. SUBSTRATE PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Yongsu Jang of Cheonan-si (KR)
Seungpil Chung of Cheonan-si (KR)
Jungyoon Yang of Cheonan-si (KR)
Inseong Lim of Cheonan-si (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18545919 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with a process chamber, a heater, and multiple protrusions for heating different portions of the processing space.
- The apparatus includes a heater that heats the lower portion of the processing space.
- A first heat source is positioned to heat the upper portion of the processing space.
- The heater has protrusions on its upper surface to enhance heat distribution.
- The second protrusion extends from the edge of the heater to further optimize heating.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems Solved: - Uneven heating in substrate processing - Inefficient heat distribution - Limited control over temperature gradients
Benefits: - Improved uniformity in substrate processing - Enhanced thermal efficiency - Precise temperature control
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can revolutionize the semiconductor industry by improving the efficiency and quality of substrate processing, leading to higher yields and better performance in electronic devices.
Questions about the technology: 1. How does the apparatus improve temperature control in substrate processing? - The apparatus utilizes a combination of a heater and a first heat source to heat different portions of the processing space, ensuring precise temperature control throughout the substrate.
2. What are the potential cost savings associated with using this technology? - By optimizing heat distribution and improving efficiency in substrate processing, this technology can lead to reduced energy consumption and lower production costs for semiconductor manufacturers.
Original Abstract Submitted
A substrate processing apparatus includes a process chamber including a processing space, a heater located inside the process chamber and configured to heat a lower portion of the processing space, and a first heat source located inside the process chamber and spaced apart from the heater and configured to heat an upper portion of the processing space, a plurality of first protrusions protruding in a vertical direction from an upper surface of the heater, and a second protrusion protruding in the vertical direction from an edge portion of the upper surface of the heater.
