18543994. PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT simplified abstract (Micron Technology, Inc.)

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PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT

Organization Name

Micron Technology, Inc.

Inventor(s)

Shriram Harihara Subramanian of Meridian ID (US)

PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18543994 titled 'PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT

Simplified Explanation:

The abstract describes a PCB land pad for a MOSFET component with four pads, including a split pad for the drain terminal.

Key Features and Innovation:

  • PCB land pad for MOSFET component
  • Four pads including split pad for drain terminal
  • First pad for gate terminal connection
  • Second pad for source terminal connection
  • Third pad for drain terminal connection
  • Fourth pad for drain terminal connection

Potential Applications: The PCB land pad can be used in various electronic devices and circuits that utilize MOSFET components.

Problems Solved: This innovation addresses the need for a specialized land pad design to efficiently connect the different terminals of a MOSFET component to a PCB.

Benefits:

  • Improved connectivity for MOSFET components
  • Enhanced performance of electronic circuits
  • Simplified assembly process for PCBs

Commercial Applications: The PCB land pad can be utilized in industries such as consumer electronics, telecommunications, automotive, and industrial automation for efficient circuit design and assembly.

Prior Art: Readers can explore existing patents related to PCB land pads for MOSFET components to understand the evolution of this technology.

Frequently Updated Research: Stay updated on the latest advancements in PCB design and MOSFET component integration for cutting-edge electronic applications.

Questions about PCB Land Pad for MOSFET Component: 1. What are the key components of a PCB land pad for a MOSFET component? 2. How does the split pad design benefit the connection of the drain terminal in a MOSFET component?

By providing a detailed and informative overview of the PCB land pad for a MOSFET component, readers can gain a better understanding of this innovative technology and its potential applications in various industries.


Original Abstract Submitted

A printed circuit board (PCB) land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component comprises four pads with a split pad for a drain terminal of the MOSFET component. The PCB land pad comprises: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.