18543499. SUBSTRATE PROCESSING DEVICE simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE PROCESSING DEVICE
Organization Name
Inventor(s)
Youngdae Chung of Incheon-si (KR)
Thomas Jongwan Kwon of Seongnam-si (KR)
SUBSTRATE PROCESSING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18543499 titled 'SUBSTRATE PROCESSING DEVICE
The patent application describes a substrate processing device that utilizes a laser to polymerize an initiator and a monomer, depositing them onto a substrate.
- Substrate processing device with a substrate support portion, fluid supply portion, and laser generation portion.
- Fluid supply portion supplies initiator and monomer towards the substrate.
- Laser generation portion irradiates a laser perpendicular to the direction of initiator and monomer supply.
- Initiator and monomer polymerize upon laser irradiation and are deposited on the substrate.
Potential Applications: - Microelectronics manufacturing - Thin film deposition - Photolithography processes
Problems Solved: - Precise control over polymerization process - Uniform deposition of materials on substrates
Benefits: - Enhanced accuracy and efficiency in material deposition - Reduction in material waste - Improved quality of thin films
Commercial Applications: Title: Advanced Substrate Processing Device for Precision Material Deposition This technology can be utilized in industries such as semiconductor manufacturing, optical coatings, and biomedical device fabrication. The precise control over material deposition offered by this device can lead to higher quality products and increased production efficiency.
Questions about Substrate Processing Device: 1. How does the laser generation portion ensure precise polymerization of the initiator and monomer? 2. What are the potential cost savings associated with using this substrate processing device in manufacturing processes?
Original Abstract Submitted
A substrate processing device includes a substrate support portion supporting a substrate, a fluid supply portion arranged above the substrate support portion and configured to supply an initiator and a monomer toward the substrate, and a laser generation portion configured to irradiate a laser in a direction intersecting a direction in which the initiator and the monomer are supplied and parallel to a surface of the substrate, wherein the initiator and the monomer are polymerized by the laser and deposited on the substrate.
