18543406. SOLDER PRINTING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SOLDER PRINTING APPARATUS
Organization Name
Inventor(s)
Seongchan Han of Suwon-si (KR)
Sangmyung Lee of Suwon-si (KR)
SOLDER PRINTING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18543406 titled 'SOLDER PRINTING APPARATUS
Simplified Explanation: The patent application describes a solder printing apparatus that sequentially feeds printed circuit boards, prints solder paste on them through a solder mask, cleans residual solder, and adjusts printing parameters based on cleaning cycles.
- The apparatus feeds printed circuit boards one by one.
- It prints solder paste on each board through a solder mask.
- It cleans residual solder from the mask after printing.
- The printing parameters are adjusted based on the cleaning cycle count.
- The control unit manages the printing and cleaning processes.
Key Features and Innovation:
- Sequential feeding of printed circuit boards.
- Printing solder paste through a solder mask.
- Cleaning residual solder from the mask.
- Adjusting printing parameters based on cleaning cycles.
- Control unit managing printing and cleaning processes.
Potential Applications: The technology can be used in electronics manufacturing for efficient solder paste printing and cleaning processes.
Problems Solved: The technology addresses the challenges of precise solder paste printing and cleaning in the manufacturing of printed circuit boards.
Benefits:
- Improved accuracy in solder paste printing.
- Efficient cleaning of residual solder.
- Customized printing parameters for each board.
- Enhanced control over the printing and cleaning processes.
Commercial Applications: The technology can be applied in the electronics industry for mass production of printed circuit boards with high precision solder paste printing and cleaning processes.
Prior Art: Prior research in the field of solder printing and cleaning processes can be explored to understand the evolution of similar technologies.
Frequently Updated Research: Stay updated on advancements in solder printing and cleaning technologies to enhance the efficiency and accuracy of the manufacturing processes.
Questions about Solder Printing Apparatus: 1. What are the key features of the solder printing apparatus? 2. How does the control unit manage the printing and cleaning processes?
Original Abstract Submitted
A solder printing apparatus including a printed circuit board feeding unit configured to sequentially feed a plurality of printed circuit boards, a solder paste printing unit configured to locate a solder mask on each of the printed circuit boards fed by the printed circuit board feeding unit and print solder paste on each of the printed circuit boards through an opening of the solder mask, a solder mask cleaning unit configured to clean residual solder from the solder mask after the solder paste is printed by the solder paste printing unit, and a control unit configured to control the solder paste printing unit and the solder mask cleaning unit, wherein the control unit is further configured to differently set a printing parameter of the solder paste printing unit for each of the printed circuit boards according to a cleaning cycle count set for the solder mask may be provided.
