18543110. CHIP STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 CHIP STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the thickness of the insulating layer parts affect the overall performance of the chip structure?
- 1.11 What are the specific manufacturing processes involved in creating the insulating layer with two different thicknesses?
- 1.12 Original Abstract Submitted
CHIP STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hong-Seng Shue of Zhubei City (TW)
Sheng-Han Tsai of Hsinchu (TW)
Kuo-Chin Chang of Chiayi City (TW)
Mirng-Ji Lii of Sinpu Township (TW)
Kuo-Ching Hsu of New Taipei City (TW)
CHIP STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18543110 titled 'CHIP STRUCTURE
Simplified Explanation
The chip structure described in the patent application includes a substrate, a redistribution layer, a bonding pad, a shielding pad, an insulating layer, and a bump. The insulating layer consists of two parts with different thicknesses.
- The chip structure includes a substrate, redistribution layer, bonding pad, shielding pad, insulating layer, and bump.
- The insulating layer has two parts with different thicknesses.
Potential Applications
This technology could be applied in semiconductor manufacturing, specifically in the production of advanced microchips and integrated circuits.
Problems Solved
This innovation helps in reducing signal interference and improving the overall performance and reliability of electronic devices.
Benefits
The chip structure with the described insulating layer design offers enhanced signal integrity, better thermal management, and increased durability.
Potential Commercial Applications
The technology could find applications in various industries such as telecommunications, consumer electronics, automotive, and aerospace.
Possible Prior Art
One possible prior art could be the use of different materials for insulating layers in semiconductor devices to improve performance and reliability.
Unanswered Questions
How does the thickness of the insulating layer parts affect the overall performance of the chip structure?
The article does not provide specific details on how the different thicknesses of the insulating layer parts impact the functionality of the chip structure. Further research or experimentation may be needed to understand this aspect better.
What are the specific manufacturing processes involved in creating the insulating layer with two different thicknesses?
The patent abstract does not delve into the specific methods or techniques used to achieve the insulating layer design with varying thicknesses. Understanding the manufacturing processes involved could provide valuable insights into the feasibility and scalability of this technology.
Original Abstract Submitted
A chip structure is provided. The chip structure includes a substrate, a redistribution layer over the substrate, a bonding pad over the redistribution layer, a shielding pad over the redistribution layer and surrounding the bonding pad, an insulating layer over the redistribution layer and the shielding pad, and a bump over the bonding pad and the insulating layer. The insulating layer includes a first part and a second part surrounded by the first part, the first part has first thickness, the second part has a second thickness, and the first thickness and the second thickness are different.
