18542843. ELECTRONIC MODULE AND CONTACT ARRANGEMENT simplified abstract (Robert Bosch GmbH)
Contents
ELECTRONIC MODULE AND CONTACT ARRANGEMENT
Organization Name
Inventor(s)
Irfan Aydogmus of NUERTINGEN (DE)
ELECTRONIC MODULE AND CONTACT ARRANGEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18542843 titled 'ELECTRONIC MODULE AND CONTACT ARRANGEMENT
The abstract describes an electronic module with a circuit carrier embedded in an encapsulation molding compound. The module includes an outer contact connection on the enclosure, electrically connected to the circuit on the circuit carrier.
- The electronic module has a circuit carrier with an embedded electrical and/or electronic circuit.
- The circuit carrier is completely embedded in an encapsulation molding compound.
- An electrically contactable outer contact connection is arranged on the enclosure, connected to the circuit on the circuit carrier.
- The contact connection is free of the encapsulating compound in the press-fit zone.
- The contact connection is accommodated in a cavity of a holding frame made of a plastics material.
- The cavity is formed by a closed wall that separates it from the encapsulating compound.
Potential Applications: - Automotive electronics - Industrial control systems - Consumer electronics
Problems Solved: - Protection of the circuit from environmental factors - Secure electrical connections - Space-saving design
Benefits: - Enhanced durability - Improved reliability - Simplified manufacturing process
Commercial Applications: Title: "Advanced Electronic Modules for Enhanced Performance in Various Industries" This technology can be used in automotive, industrial, and consumer electronics sectors to improve product performance and reliability.
Prior Art: Prior art related to this technology may include patents or publications on encapsulated electronic modules and contact connection arrangements in electronic devices.
Frequently Updated Research: Researchers may be exploring new materials for encapsulation molding compounds or innovative designs for contact connections in electronic modules.
Questions about Electronic Modules: 1. How does the encapsulation molding compound protect the circuit in the electronic module? 2. What are the key advantages of using a holding frame for the contact connection in the module?
Original Abstract Submitted
An electronic module. The electronic module includes a circuit carrier having an electrical and/or electronic circuit. This circuit is completely embedded in an encapsulation molding compound. The electronic module includes an electrically contactable outer contact connection arranged on the enclosure, which has a press-fit zone. The contact connection is electrically connected to the electrical and/or electronic circuit on an upper side of the circuit carrier facing the press-fit zone. In the region of the press-in zone, the contact connection in the enclosure is free of the encapsulating compound. The contact connection is accommodated in a cavity of a holding frame made of a plastics material. The cavity is formed by a closed wall running around the contact connection, which rests on the upper side of the circuit carrier and projects in a direction of the press-fit zone. The wall separates the cavity from the encapsulating compound.
