18542776. SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
Organization Name
Inventor(s)
Young Jo Jin of Hwaseong-si (KR)
Sang Jeong Lee of Hwaseong-si (KR)
Tae Hwan Lee of Cheonan-si (KR)
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18542776 titled 'SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
Simplified Explanation: The patent application describes a method and apparatus for treating a substrate by adjusting cooling efficiency. The method involves heating the substrate's surface and then cooling it using a cooling gas. The cooling process includes controlling the cooling conditions.
- The method involves heating the substrate's surface and then cooling it using a cooling gas.
- The cooling process includes controlling the cooling conditions.
Key Features and Innovation:
- Substrate treatment method and apparatus for adjusting cooling efficiency.
- Heating process followed by a cooling process using a cooling gas.
- Cooling process includes controlling cooling conditions.
Potential Applications: This technology can be used in various industries such as semiconductor manufacturing, electronics, and materials science for precise substrate treatment.
Problems Solved:
- Adjusting cooling efficiency for substrates.
- Ensuring controlled cooling conditions for optimal results.
Benefits:
- Improved substrate treatment process.
- Enhanced cooling efficiency.
- Precise control over cooling conditions.
Commercial Applications: The technology can be applied in semiconductor manufacturing, electronics production, and materials science research for efficient and precise substrate treatment processes.
Prior Art: Prior art related to this technology may include patents or research papers on substrate treatment methods and apparatus for adjusting cooling efficiency.
Frequently Updated Research: Researchers may be exploring advancements in substrate treatment methods and apparatus to further enhance cooling efficiency and control.
Questions about Substrate Treatment Method and Apparatus: 1. How does the cooling gas contribute to adjusting cooling efficiency in substrate treatment? 2. What are the potential industrial applications of this technology in semiconductor manufacturing and electronics production?
Original Abstract Submitted
Proposed are a substrate treatment method and a substrate treatment apparatus that are capable of adjusting cooling efficiency for a substrate. According to an embodiment of the present disclosure, there may be provided the substrate treatment method including a heating process in which a surface of the substrate is heated and a cooling process in which the substrate is cooled by supplying a cooling gas to a lower surface of the substrate. Furthermore, the cooling process includes a cooling condition controlling process in which a cooling condition is controlled.
