18542665. SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD simplified abstract (SEMES CO., LTD.)

SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD

Organization Name

SEMES CO., LTD.

Inventor(s)

Young Eun Jeon of Ulsan-si (KR)

Yun Sang Kim of Seongnam-si (KR)

Min Sung Jeon of Osan-si (KR)

Tae Hwan Lee of Cheonan-si (KR)

Sung Min Choi of Osan-si (KR)

Jin Hee Hong of Hwaseong-si (KR)

Dong Young Jang of Seongnam-si (KR)

Young Jo Jin of Hwaseong-si (KR)

SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18542665 titled 'SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD

Simplified Explanation: The patent application describes a substrate treatment system and method that allows for precise etching adjustments and increases the Unit Per Equipment Hour (UPEH) by reducing process time.

Key Features and Innovation:

• Technology for fine etching adjustment
• Increased UPEH by reducing process time

Potential Applications: The technology can be used in semiconductor manufacturing, electronics production, and other industries requiring precise substrate treatment.

Problems Solved: The technology addresses the need for fine etching adjustments and efficiency improvements in substrate treatment processes.

Benefits:

• Enhanced precision in etching adjustments
• Increased productivity with reduced process time

Commercial Applications: The technology can be applied in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions to improve substrate treatment processes and increase overall efficiency.

Prior Art: Readers can explore prior patents related to substrate treatment systems and methods to understand the evolution of this technology.

Frequently Updated Research: Stay informed about the latest advancements in substrate treatment systems and methods to ensure the most up-to-date information on this technology.

Questions about Substrate Treatment Systems: 1. What are the key advantages of using a substrate treatment system? 2. How does the technology in this patent application improve substrate treatment processes?

Original Abstract Submitted

Proposed are a substrate treatment system and a substrate treatment method. More particularly, a technology capable of realizing a fine etching adjustment and capable of increasing a Unit Per Equipment Hour (UPEH) by reducing time required for a process is provided.