18541776. MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)

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MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Organization Name

Samsung Electro-Mechanics Co., Ltd.

Inventor(s)

Yang-Seok Park of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18541776 titled 'MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Simplified Explanation: The patent application describes a multilayer electronic component with a protective layer made of oxides in a wired form to enhance moisture resistance reliability.

  • The protective layer is made of oxides in a wired form.
  • The layer is placed on the external surface of the body or in the space between the body and a side margin portion.
  • The surface of the component exhibits superhydrophobicity, improving moisture resistance reliability.

Key Features and Innovation:

  • Protective layer made of oxides in a wired form.
  • Placement on external surface or in the space between body and side margin.
  • Superhydrophobic surface for enhanced moisture resistance reliability.

Potential Applications: The technology can be applied in various electronic components requiring high moisture resistance, such as sensors, circuit boards, and communication devices.

Problems Solved: The technology addresses the issue of moisture damage in electronic components, improving their reliability and longevity.

Benefits:

  • Enhanced moisture resistance reliability.
  • Improved longevity of electronic components.
  • Better performance in humid environments.

Commercial Applications: The technology can be utilized in the manufacturing of electronic devices for industries like telecommunications, automotive, and consumer electronics, where moisture resistance is crucial.

Questions about Multilayer Electronic Components: 1. How does the superhydrophobic surface improve moisture resistance reliability? 2. What are the potential drawbacks of using oxides in a wired form for the protective layer?


Original Abstract Submitted

In a multilayer electronic component according to an aspect or another aspect of the present disclosure, a protective layer including a plurality of oxides having a wired form is disposed on at least a portion of an external surface of a body. Alternatively or optionally, the protective layer including an oxide having a wired form is disposed on at least a portion of a space between the body and a side margin portion. A surface of the multilayer electronic component has superhydrophobicity, thereby improving moisture resistance reliability of the multilayer electronic component.

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