18541164. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
SUBSTRATE PROCESSING APPARATUS
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SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18541164 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with a stage, a freezing device, an elevating device, and a heat conductive member.
- The stage has a first contact surface for substrate placement.
- The freezing device has a second contact surface for cooling.
- The elevating device can connect or separate the second contact surface and the first contact surface.
- A heat conductive member made of soft metal is placed between the first and second contact surfaces.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems Solved: - Efficient cooling of substrates - Precise temperature control during processing
Benefits: - Improved processing quality - Enhanced productivity - Cost-effective solution
Commercial Applications: - Semiconductor industry - Electronics manufacturing - Research and development labs
Questions about the technology: 1. How does the soft metal heat conductive member improve thermal conductivity? 2. What are the specific advantages of using a freezing device in substrate processing?
Frequently Updated Research: - Ongoing studies on optimizing cooling techniques in substrate processing.
Original Abstract Submitted
A substrate processing apparatus includes: a stage having a first contact surface; a freezing device having a second contact surface; an elevating device to be capable of thermally connecting or separating the second contact surface and the first contact surface; and a heat conductive member interposed between the first contact surface and the second contact surface, wherein the heat conductive member is made of a soft metal that is softer than at least one of a material of the first contact surface or a material of the second contact surface.