18541147. SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGES HAVING CAPACITORS
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES HAVING CAPACITORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18541147 titled 'SEMICONDUCTOR PACKAGES HAVING CAPACITORS
The semiconductor package described in the patent application consists of a package substrate, an interposer, connection terminals, two semiconductor chips, a bridge, and a capacitor structure within the interposer.
- The package substrate serves as the foundation for the semiconductor package.
- The interposer is positioned above the package substrate and facilitates connections between components.
- Connection terminals link the package substrate with the interposer.
- Two semiconductor chips are located above the interposer.
- A bridge within the interposer connects the two semiconductor chips.
- The capacitor structure within the interposer includes upper and lower capacitors.
- Chip connection terminals enable communication between the interposer and the semiconductor chips.
Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices. - It can be used in high-performance computing systems. - The capacitor structure can enhance the power efficiency of electronic devices.
Problems Solved: - Improved connectivity and communication between semiconductor components. - Enhanced power efficiency through the capacitor structure. - Facilitates the integration of multiple semiconductor chips in a compact package.
Benefits: - Increased performance and efficiency of semiconductor devices. - Enhanced reliability and connectivity. - Enables the development of more compact and powerful electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Computing Systems This technology can be utilized in the production of high-performance computing systems, data centers, and other advanced electronic devices. It offers improved connectivity, power efficiency, and performance, making it ideal for applications requiring high-speed data processing and reliability.
Questions about Semiconductor Packaging Technology: 1. How does the capacitor structure within the interposer contribute to the efficiency of the semiconductor package? 2. What are the potential challenges in implementing this advanced semiconductor packaging technology in commercial electronic devices?
Original Abstract Submitted
A semiconductor package includes a package substrate, an interposer above the package substrate, a connection terminal between the package substrate and the interposer, a first semiconductor chip and a second semiconductor chip above the interposer, a bridge in the interposer, the bridge connected to the first semiconductor chip and the second semiconductor chip, a capacitor structure in the interposer, the capacitor structure including an upper structure including an upper capacitor and a lower structure including a lower capacitor, and a chip connection terminal including at least one first chip connection terminal between the interposer and the first semiconductor chip and at least one second chip connection terminal between the interposer and the second semiconductor chip.
