18540733. METHOD OF MANUFACTURING DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)

METHOD OF MANUFACTURING DISPLAY DEVICE

Organization Name

Samsung Display Co., LTD.

Inventor(s)

YOUNGJIN Oh of Yongin-si (KR)

JINHYEONG Kim of Yongin-si (KR)

HO YUN Kang of Yongin-si (KR)

SANG-PIL Park of Yongin-si (KR)

KYUNG CHUL Shin of Yongin-si (KR)

DONGKEUN Lee of Yongin-si (KR)

GIHAN Leem of Yongin-si (KR)

HEE-CHEOL Im of Yongin-si (KR)

JAEJIN Pyun of Yongin-si (KR)

METHOD OF MANUFACTURING DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18540733 titled 'METHOD OF MANUFACTURING DISPLAY DEVICE

The method of manufacturing a display device involves removing layers using a pulsed laser beam.

• Processing target includes first, second, and third layers.
• Third layer has lower absorptance than first and second layers.
• Layers are removed sequentially by irradiating with a pulsed laser beam.

Potential Applications: - Manufacturing of display devices - Semiconductor industry for layer removal processes

Problems Solved: - Efficient and precise removal of layers in manufacturing processes

Benefits: - Improved manufacturing efficiency - Enhanced precision in layer removal

Commercial Applications: Title: Advanced Display Device Manufacturing Method This technology can be used in the production of high-quality display devices, enhancing the competitiveness of companies in the electronics industry.

Questions about Display Device Manufacturing Method: 1. How does the use of a pulsed laser beam improve the efficiency of layer removal in display device manufacturing? 2. What are the potential cost savings associated with this innovative manufacturing method?

Original Abstract Submitted

A method of manufacturing a display device includes preparing a processing target including a first layer, a second layer, and a third layer located between the first layer and the second layer and having an absorptance that is smaller than each of an absorptance of the first layer and an absorptance of the second layer, and sequentially removing the first layer and the second layer by irradiating a pulsed laser beam to the processing target.